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TSC2014IYZGR

Texas Instruments

TSC2014IYZGR by Texas Instruments

TSC2014IYZGR by Texas Instruments is a MICROCONTROLLER with 12 terminals, operating b/w -40 to 85 °C. It features ADC channels, CMOS technology, and a supply voltage range of 1.2V to 3.6V. Ideal for industrial applications requiring precise control in compact spaces.

Median Price

$2.290

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,621 parts In-Stock

1+ parts

$2.630

100+ parts

$2.305

1k+ parts

$1.302

10k+ parts

-

12,621

$2.630

$2.305

$1.302

-

Rochester

USA . 10,211 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.680

10k+ parts

$1.580

10,211

-

$1.880

$1.680

$1.580

DigiKey

USA . 10,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.480

10k+ parts

-

10,211

-

-

$2.480

-

Verical

USA . 7,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.100

10k+ parts

$1.975

7,530

-

-

$2.100

$1.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,641 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,641

$1.720

-

-

-

Vyrian

USA . 2,231 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

-

10k+ parts

-

2,231

$1.810

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,941 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

10k+ parts

-

10,941

$1.540

-

-

-

Corphita

USA . 3,298 parts In-Stock

1+ parts

$1.629

100+ parts

-

1k+ parts

-

10k+ parts

-

3,298

$1.629

-

-

-

Vigor

Singapore . 11,792 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

11,792

$1.930

-

-

-

Parana Technologies

USA . 911 parts In-Stock

1+ parts

$67.333

100+ parts

-

1k+ parts

-

10k+ parts

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911

$67.333

-

-

-

DigiPath Technology Company

USA . 510 parts In-Stock

1+ parts

$74.142

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$74.142

-

-

-

ChromeModa Solutions

Germany . 1,607 parts In-Stock

1+ parts

$75.655

100+ parts

$62.037

1k+ parts

-

10k+ parts

-

1,607

$75.655

$62.037

-

-

IDEA Electronic Components Group

UK . 1,511 parts In-Stock

1+ parts

$75.655

100+ parts

$71.872

1k+ parts

$68.090

10k+ parts

-

1,511

$75.655

$71.872

$68.090

-

A-Z Elektronik GmbH

Germany . 5,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,480

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Kepictronics

USA . 1,998 parts In-Stock

1+ parts

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1,998

-

-

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Assy Fe

Spain . 1,998 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,998

-

-

-

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Infinite Electronics LLP (Excess)

. 450 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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450

-

-

-

-

Overview

Elevate your projects to new heights with the TSC2014IYZGR by Texas Instruments. This cutting-edge microcontroller boasts unparalleled quality and precision, thanks to the renowned craftsmanship of its manufacturer. Perfect for a wide range of applications, this product offers unmatched value and benefits to customers seeking reliability and efficiency. Experience the advantages of top-tier technology with the TSC2014IYZGR and see your creations soar to new levels of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to design and fit into standard circuit layouts.

No. of Terminals: 12

Having a sufficient number of terminals enables connectivity to other components and peripherals.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density, space-saving, and improved electrical performance for the product.

Minimum Supply Voltage: 1.2 V

Allows operation at lower voltage levels, saving power and extending battery life.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

Can operate in harsh environmental conditions or industrial settings with low temperatures.

Terminal Finish: TIN SILVER COPPER

Provides good solderability, conductivity, and corrosion resistance for the terminal connections.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) channels enable the product to sample and convert analog signals into digital data.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and convenient PCB mounting and soldering.

Maximum Seated Height: 0.625 mm

Low profile design saves space and allows for compact device designs.

Width: 1.55 mm

Narrow width provides flexibility in PCB layout and design.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a sufficient duration during soldering process.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during the soldering process without damage.

Length: 2.055 mm

Compact length allows for space-saving and efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making it suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller functionality provides processing power and control for various applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form facilitates reliable electrical connections and assembly in the manufacturing process.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage ensures consistent and reliable operation of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB designs.

Speed: 4.3 rpm

The operational speed of 4.3 rotations per minute provides efficient processing capabilities for the microcontroller.

Technical Specifications

Microcontrollers TSC2014IYZGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

2.055 mm

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Speed:

4.3 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.55 mm

Peripheral IC Type:

Trade Compliance

TSC2014IYZGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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