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TSB41BA3ATPFPEP

Texas Instruments

TSB41BA3ATPFPEP by Texas Instruments

TSB41BA3ATPFPEP by Texas Instruments is a Line Driver & Receiver with 6 functions, operating at -40 to 110°C. It features differential output, complies with IEEE 1394 standard, and has a max supply voltage of 3.6V. Ideal for industrial applications requiring high-speed data transmission over short distances.

Median Price

$42.071

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12 parts In-Stock

1+ parts

$8.915

100+ parts

-

1k+ parts

-

10k+ parts

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12

$8.915

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-

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Verical

USA . 12 parts In-Stock

1+ parts

$37.297

100+ parts

-

1k+ parts

-

10k+ parts

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12

$37.297

-

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Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$40.770

100+ parts

-

1k+ parts

-

10k+ parts

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12

$40.770

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Texas Instruments

USA . 17,731 parts In-Stock

1+ parts

$43.372

100+ parts

$38.553

1k+ parts

$28.348

10k+ parts

-

17,731

$43.372

$38.553

$28.348

-

DigiKey

USA . 39 parts In-Stock

1+ parts

$62.590

100+ parts

-

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39

$62.590

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Mouser Electronics

USA . 35 parts In-Stock

1+ parts

$62.590

100+ parts

$48.610

1k+ parts

-

10k+ parts

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35

$62.590

$48.610

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,225 parts In-Stock

1+ parts

$32.386

100+ parts

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1,225

$32.386

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Vyrian

USA . 7,833 parts In-Stock

1+ parts

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7,833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,365 parts In-Stock

1+ parts

$2.441

100+ parts

-

1k+ parts

$2.936

10k+ parts

-

1,365

$2.441

-

$2.936

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DigiPath Technology Company

USA . 1,891 parts In-Stock

1+ parts

$2.688

100+ parts

$2.473

1k+ parts

-

10k+ parts

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1,891

$2.688

$2.473

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ChromeModa Solutions

Germany . 2,278 parts In-Stock

1+ parts

$2.743

100+ parts

$2.249

1k+ parts

-

10k+ parts

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2,278

$2.743

$2.249

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IDEA Electronic Components Group

UK . 429 parts In-Stock

1+ parts

$2.743

100+ parts

-

1k+ parts

$2.469

10k+ parts

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429

$2.743

-

$2.469

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Corphita

USA . 2,932 parts In-Stock

1+ parts

$30.681

100+ parts

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2,932

$30.681

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Component Stockers USA

USA . 120 parts In-Stock

1+ parts

$39.680

100+ parts

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1k+ parts

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10k+ parts

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120

$39.680

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Kepictronics

USA . 9,000 parts In-Stock

1+ parts

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100+ parts

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9,000

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Overview

Elevate your electronic designs with the TSB41BA3ATPFPEP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This line driver & receiver is perfect for various applications, providing exceptional value and benefits to customers. With its advanced features and impressive performance, this product offers unmatched advantages that will take your projects to the next level. Choose Texas Instruments for excellence in electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 2 V

Operating within a maximum supply voltage of 2V makes it suitable for low power applications, helping to conserve energy and reduce heat dissipation.

No. of Functions: 6

With 6 functions in one device, it offers versatility and integration, reducing the need for multiple components and simplifying design complexity.

Maximum Supply Voltage-1: 3.6 V

Having a maximum supply voltage of 3.6V allows for flexibility in power supply options, catering to a wider range of operating conditions.

Power Supplies (V): 1.8,3.3

Supporting multiple power supply voltages of 1.8V and 3.3V offers compatibility with various systems and ensures stable operation under different voltage requirements.

No. of Terminals: 80

With 80 terminals, it provides ample connection points for interfacing with other components, enabling comprehensive functionality and connectivity.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles available caters to different installation requirements, offering flexibility in design and accommodating various board layouts.

Minimum Supply Voltage-1: 3 V

Operating at a minimum supply voltage of 3V ensures reliability and stability during low voltage conditions, maintaining consistent performance.

Output Characteristics: DIFFERENTIAL

Differential output helps to improve signal integrity, reduce noise interference, and enhance data transmission reliability, making it suitable for high-speed communication applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, it is suitable for use in harsh environments or extreme conditions, providing resilience and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel-palladium-gold terminal finish ensures good conductivity, corrosion resistance, and solderability, enhancing the overall reliability and longevity of the product.

Maximum Output Low Current: 4 Amp

Capable of handling a maximum output low current of 4A, it supports high current applications, providing robust performance and reliability in demanding situations.

Output Polarity: COMPLEMENTARY

Complementary output polarity helps to simplify signal processing, improve noise immunity, and enhance system performance, making it a reliable choice for data transmission.

Receiver No. of Bits: 6

With 6 receiver bits, it offers accurate data reception and transmission, ensuring precision and reliability in communication systems.

Differential Output: YES

Having a differential output enables noise rejection, signal amplification, and improved signal quality, making it suitable for high-speed data transmission and long-distance communication.

Length: 12 mm

With a compact length of 12mm, it saves space on the circuit board, allowing for efficient board layout and maximizing design flexibility.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm enables high-density mounting, reducing PCB footprint and allowing for compact and miniaturized designs.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver interface IC type, it facilitates communication between different systems or networks, ensuring seamless data exchange and interoperability.

Technical Specifications

Line Drivers & Receivers TSB41BA3ATPFPEP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Terminals:

80

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.172 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

4 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.75 V

Nominal Supply Voltage:

1.85 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB41BA3ATPFPEP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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