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TS5A3159ADBVRG4

Texas Instruments

TS5A3159ADBVRG4 by Texas Instruments

TS5A3159ADBVRG4 by Texas Instruments is a SPDT switch with 6 terminals, operating at -40 to 85°C. It has a low on-state resistance of 2.5 ohm and fast switching times of 75 ns on and 50 ns off. Ideal for industrial applications requiring high isolation and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,770 parts In-Stock

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Vyrian

USA . 2,550 parts In-Stock

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2,550

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Resion

USA . 700 parts In-Stock

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700

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semicontronic

India . 736 parts In-Stock

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$1.500

100+ parts

$1.462

1k+ parts

$1.455

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736

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 654 parts In-Stock

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$1.500

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Corohmni

South Africa . 748 parts In-Stock

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$4.820

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$4.820

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Ampacity Inc.

Singapore . 1,412 parts In-Stock

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$5.500

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$5.500

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AZTECH Wire

Italy . 639 parts In-Stock

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$9.592

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$9.592

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Parana Technologies

USA . 492 parts In-Stock

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$17.965

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$18.128

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492

$17.965

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$18.128

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IDEA Electronic Components Group

UK . 2,319 parts In-Stock

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$20.185

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$19.176

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$18.166

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ChromeModa Solutions

Germany . 1,348 parts In-Stock

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$20.185

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$16.552

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Continental Prestige Electronics

USA . 6,777 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Microchip USA

USA . 2,522 parts In-Stock

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Argo Parts USA

USA . 1,353 parts In-Stock

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DigiPath Technology Company

USA . 744 parts In-Stock

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$18.199

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Corphita

USA . 618 parts In-Stock

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Bastille Electronics

Australia . 78 parts In-Stock

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Advanced Electronics

New Zealand . 38 parts In-Stock

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Overview

Experience the seamless performance and reliability of the TS5A3159ADBVRG4 by Texas Instruments, a leading manufacturer in the industry. This versatile multiplexer/switch offers unparalleled quality and precision, making it ideal for a wide range of applications. With its compact design and advanced features, this product provides customers with exceptional value, efficiency, and performance. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Nominal Supply Voltage (Vsup): 1.8 V

Operates at a low voltage, making it energy efficient and suitable for use in low power applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in various operating conditions.

Nominal Bandwidth: 100 kHz

Provides a high bandwidth capacity, allowing for efficient signal transmission and processing.

Temperature Grade: INDUSTRIAL

Designed to meet industrial operating standards, making it suitable for industrial applications where reliability is crucial.

Technical Specifications

Multiplexers & Switches TS5A3159ADBVRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

100 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

64 dB

Nominal On-state Resistance Match:

.15 ohm

Maximum On-state Resistance (Ron):

2.5 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.0001 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

50 ns

Maximum Switch-on Time:

75 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TS5A3159ADBVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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