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TS3L500RHURG4

Texas Instruments

TS3L500RHURG4 by Texas Instruments

TS3L500RHURG4 by Texas Instruments is an 8-function SPDT switch with 11 channels, operating at industrial temperature grade. It features a max on-state resistance of 6 ohm, switching time of 15 ns, and nominal bandwidth of 1100 kHz. Ideal for applications requiring high-speed signal routing in industrial settings.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 5,876 parts In-Stock

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Digiode

USA . 2,465 parts In-Stock

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Bristol Electronics

USA . 968 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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One Stop Electronics

USA . 656 parts In-Stock

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$4.500

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Parana Technologies

USA . 706 parts In-Stock

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$5.885

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$546.482

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$5.296

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706

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DigiPath Technology Company

USA . 1,106 parts In-Stock

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$6.480

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ChromeModa Solutions

Germany . 2,587 parts In-Stock

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$6.612

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$5.422

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IDEA Electronic Components Group

UK . 584 parts In-Stock

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$5.951

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AZTECH Wire

Italy . 823 parts In-Stock

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$19.146

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QUARKTWIN TECHNOLOGY LTD

USA . 19,708 parts In-Stock

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Corphita

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Microchip USA

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iodParts Technologies Inc.

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Perfect Parts

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Kepictronics

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Overview

Experience unparalleled performance and reliability with the TS3L500RHURG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line multiplexers & switches that cater to a wide range of applications. This versatile product boasts 8 functions, separate output, and a nominal bandwidth of 1100 kHz. With a maximum supply voltage of 3.6V and industrial-grade temperature tolerance, this chip carrier promises seamless operation in various conditions. Elevate your projects with the quality and precision of Texas Instruments, making the TS3L500RHURG4 an essential component for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package sturdy and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and compact installation on circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 8

Having 8 functions in one device increases efficiency and simplifies circuit design, reducing component count and complexity.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal operating voltage of 3.3V is common and widely supported, making integration into existing systems easier.

Power Supplies (V): 3.3

Having a consistent power supply voltage of 3.3V ensures stable and reliable operation.

No. of Terminals: 56

With a high number of terminals, this product can accommodate a wide range of connections and functionalities, offering versatility in circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility for different mounting options and thermal management requirements, catering to diverse application needs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial environments with demanding temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in cold environments, increasing the product's versatility for different operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple high-quality terminal finishes enhances conductivity and corrosion resistance, ensuring long-term reliability and performance.

Technical Specifications

Multiplexers & Switches TS3L500RHURG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

1100 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PQCC-N56

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

11

No. of Functions:

8

No. of Terminals:

56

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

9 ns

Maximum Switch-on Time:

15 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

TS3L500RHURG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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