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TS3L110DG4

Texas Instruments

TS3L110DG4 by Texas Instruments

TS3L110DG4 by Texas Instruments is a 4-channel SPDT switch with 8 ohm Ron, 7 ns switch-on time, and 500 kHz bandwidth. Ideal for industrial applications requiring separate output signals in a compact package with dual terminals and -40 to 85°C operating temperature range.

Median Price

$3.100

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 463 parts In-Stock

1+ parts

$3.100

100+ parts

$1.860

1k+ parts

$0.969

10k+ parts

-

463

$3.100

$1.860

$0.969

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,267 parts In-Stock

1+ parts

$1.814

100+ parts

-

1k+ parts

-

10k+ parts

-

3,267

$1.814

-

-

-

Vyrian

USA . 5,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,689

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,693 parts In-Stock

1+ parts

$1.719

100+ parts

-

1k+ parts

-

10k+ parts

-

1,693

$1.719

-

-

-

Corohmni

South Africa . 108 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

108

$1.910

-

-

-

Ampacity Inc.

Singapore . 198 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

198

$2.370

-

-

-

Semicontronic

India . 86 parts In-Stock

1+ parts

$2.370

100+ parts

$2.311

1k+ parts

$2.299

10k+ parts

-

86

$2.370

$2.311

$2.299

-

Parana Technologies

USA . 1,108 parts In-Stock

1+ parts

$20.778

100+ parts

-

1k+ parts

$20.930

10k+ parts

-

1,108

$20.778

-

$20.930

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DigiPath Technology Company

USA . 147 parts In-Stock

1+ parts

$22.879

100+ parts

$21.049

1k+ parts

-

10k+ parts

-

147

$22.879

$21.049

-

-

IDEA Electronic Components Group

UK . 2,083 parts In-Stock

1+ parts

$23.346

100+ parts

$22.179

1k+ parts

$21.011

10k+ parts

-

2,083

$23.346

$22.179

$21.011

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ChromeModa Solutions

Germany . 433 parts In-Stock

1+ parts

$23.346

100+ parts

$19.144

1k+ parts

-

10k+ parts

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433

$23.346

$19.144

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-

Microchip USA

USA . 1,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,131

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Overview

Enhance your electronics projects with the TS3L110DG4 by Texas Instruments, a high-quality multiplexer and switch designed to meet the demands of industrial applications. With its durable plastic/epoxy package body material and reliable performance, this versatile component offers customers exceptional value and benefits. Whether you're looking to improve signal routing, enhance audio systems, or streamline data transmission, the TS3L110DG4 delivers seamless operation and precise control. Trust in Texas Instruments' reputation for excellence and choose the TS3L110DG4 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into PCBs, saving space and simplifying assembly.

No. of Functions: 4

With 4 functions in one device, it provides flexibility and efficiency in managing multiple input/output signals.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common voltage level in many electronic systems, ensuring compatibility and ease of integration.

Power Supplies (V): 3.3

Consistent power supply at 3.3V ensures stable operation and reliable performance of the multiplexer or switch.

No. of Terminals: 16

The 16 terminals provide ample connection points for various inputs and outputs, allowing for versatile signal routing.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the device can withstand demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85°C ensures operation in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold for terminal finish provides excellent conductivity, corrosion resistance, and reliability.

Output (V): SEPARATE OUTPUT

Separate output channels ensure signal integrity and minimize interference between different channels.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75mm saves space and allows for compact designs in electronic systems.

Width (mm): 3.9 mm

Narrow width of 3.9mm enables dense packing of components on the PCB for efficient use of board space.

Other IC type: SPDT

Single Pole Double Throw (SPDT) configuration offers versatility in signal routing and switching applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures proper operation of the device within specified voltage limits.

Maximum Time At Peak Reflow Temperature (s): 30

The device can withstand peak reflow temperatures for up to 30 seconds during soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for lead-free soldering and RoHS compliance.

Maximum On-state Resistance (Ron): 8 ohm

Low on-state resistance of 8 ohms minimizes signal loss and ensures efficient signal transmission.

Maximum Switch-on Time: 7 ns

Fast switch-on time of 7 nanoseconds enables quick response and low latency in signal switching applications.

Length: 9.9 mm

The compact length of 9.9mm allows for space-saving integration in tight layouts or crowded PCBs.

Maximum Switch-off Time: 5 ns

Quick switch-off time of 5 nanoseconds ensures rapid signal disconnection for precision timing requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions and industrial settings.

Maximum Supply Current (Isup): 1.5 mA

Low supply current draw of 1.5 mA helps in minimizing power consumption and heat dissipation in the system.

No. of Channels: 4

4 channels allow for multiplexing or switching between multiple input/output signals, increasing versatility and functionality.

Nominal Bandwidth: 500 kHz

The 500 kHz nominal bandwidth supports high-speed signal processing and data transmission for efficient performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting and soldering processes, enhancing assembly efficiency.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact PCB layout, suitable for high-density applications.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, the device can safely operate within specified voltage limits without risk of damage.

Maximum Signal Current: 0.128 A

The maximum signal current of 0.128A ensures compatibility with a wide range of electronic devices and circuits.

Nominal Off-state Isolation: 28 dB

High off-state isolation of 28 dB minimizes crosstalk and interference between channels, maintaining signal integrity.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching ensures that there is no overlap between signals during switching, preventing short circuits or signal distortion.

Nominal On-state Resistance Match: 0.9 ohm

Nominal on-state resistance match of 0.9 ohms ensures balanced signal paths and uniform performance across all channels.

Technical Specifications

Multiplexers & Switches TS3L110DG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

500 kHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

28 dB

Nominal On-state Resistance Match:

.9 ohm

Maximum On-state Resistance (Ron):

8 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

1.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

5 ns

Maximum Switch-on Time:

7 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TS3L110DG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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