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TRSF3243CDBRG4

Texas Instruments

TRSF3243CDBRG4 by Texas Instruments

TRSF3243CDBRG4 by Texas Instruments is a Line Driver & Receiver with 5 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual terminal position. Ideal for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,794 parts In-Stock

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8,794

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Digiode

USA . 392 parts In-Stock

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392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 453 parts In-Stock

1+ parts

$11.445

100+ parts

-

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$11.865

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-

453

$11.445

-

$11.865

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

1+ parts

$12.860

100+ parts

$10.545

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4,083

$12.860

$10.545

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IDEA Electronic Components Group

UK . 590 parts In-Stock

1+ parts

$12.860

100+ parts

$12.217

1k+ parts

$11.574

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590

$12.860

$12.217

$11.574

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AZTECH Wire

Italy . 379 parts In-Stock

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$16.181

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379

$16.181

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One Stop Electronics

USA . 274 parts In-Stock

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$20.500

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274

$20.500

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Component Stockers USA

USA . 254 parts In-Stock

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$99.990

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254

$99.990

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Corphita

USA . 3,156 parts In-Stock

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DigiPath Technology Company

USA . 1,916 parts In-Stock

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$11.595

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Microchip USA

USA . 155 parts In-Stock

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Overview

Enhance your electronic designs with the TRSF3243CDBRG4 by Texas Instruments, a top-quality line driver and receiver that offers superior performance and reliability. Manufactured by Texas Instruments, a renowned leader in the industry, this product is perfect for a wide range of applications. With its advanced features and compact design, this small outline shrink pitch package delivers unmatched value and benefits to customers. Upgrade your projects today with the TRSF3243CDBRG4 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, making it suitable for a variety of applications.

No. of Functions: 5

Offers multiple functions in a single component, reducing the need for additional components in the circuit.

Package Shape: RECTANGULAR

Compact design that can fit easily in limited space on a circuit board.

Power Supplies (V): 3.3/5

Compatible with different power supply voltages, providing flexibility in system design.

No. of Terminals: 28

Sufficient terminals for connecting to other components and peripherals in the circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Space-saving design that allows for more components to be placed on the circuit board.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement, reducing power consumption and heat generation.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, saving energy and cost in powering the device.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature: 0 °C

Suitable for operation in low-temperature conditions, ensuring reliability in various environments.

Terminal Position: DUAL

Provides redundancy in connectivity, enhancing the reliability of the connection.

Maximum Seated Height: 2 mm

Low profile design that can be easily accommodated in compact electronic devices.

Width: 5.3 mm

Narrow width for space-efficient placement on circuit boards.

Maximum Output Low Current: 1.6 Amp

Capable of driving external components with high current requirements, expanding its usability.

Receiver No. of Bits: 5

Provides high-resolution data reception, ensuring accurate signal processing.

Length: 10.2 mm

Compact length that saves space on the circuit board.

Minimum Out Swing: 10 V

Supports a wide voltage swing for reliable signal transmission.

Temperature Grade: COMMERCIAL

Suitable for use in standard commercial applications, providing compatibility with a wide range of systems.

Maximum Receive Delay: 0 ns

Minimal delay in receiving signals, ensuring real-time data processing.

Terminal Form: GULL WING

Easy to solder onto the circuit board, simplifying the assembly process.

Interface Standard: EIA-232

Complies with the EIA-232 standard for reliable communication with other devices.

Maximum Supply Current: 1 mA

Low power consumption, reducing energy costs and heat dissipation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input for noise immunity and reliable signal detection.

Nominal Supply Voltage: 3.3 V

Optimal supply voltage for efficient operation and performance.

Terminal Pitch: 0.65 mm

Fine pitch for compact layout on the circuit board, saving space.

Driver No. of Bits: 3

Three-bit driver for accurate signal transmission and control.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface for robust communication and signal handling.

Technical Specifications

Line Drivers & Receivers TRSF3243CDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3243CDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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