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TRSF3238ECDBR

Texas Instruments

TRSF3238ECDBR by Texas Instruments

TRSF3238ECDBR by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features a small outline package style and Schmitt trigger input characteristics. Ideal for EIA-232-F, TIA-232-F, V.28 interface standards in commercial temperature grade applications.

Median Price

$1.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,744 parts In-Stock

1+ parts

$1.210

100+ parts

$1.190

1k+ parts

$1.160

10k+ parts

-

4,744

$1.210

$1.190

$1.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,237

-

-

-

-

Vyrian

USA . 2,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,074

-

-

-

-

Cyclops Electronics Ltd

UK . 405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

405

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 666 parts In-Stock

1+ parts

$8.418

100+ parts

-

1k+ parts

$9.055

10k+ parts

-

666

$8.418

-

$9.055

-

DigiPath Technology Company

USA . 1,359 parts In-Stock

1+ parts

$9.269

100+ parts

-

1k+ parts

-

10k+ parts

-

1,359

$9.269

-

-

-

ChromeModa Solutions

Germany . 6,366 parts In-Stock

1+ parts

$9.458

100+ parts

$7.756

1k+ parts

-

10k+ parts

-

6,366

$9.458

$7.756

-

-

IDEA Electronic Components Group

UK . 2,225 parts In-Stock

1+ parts

$9.458

100+ parts

$8.985

1k+ parts

$8.512

10k+ parts

-

2,225

$9.458

$8.985

$8.512

-

Microchip USA

USA . 4,971 parts In-Stock

1+ parts

$11.593

100+ parts

-

1k+ parts

-

10k+ parts

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4,971

$11.593

-

-

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$19.455

100+ parts

-

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696

$19.455

-

-

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One Stop Electronics

USA . 604 parts In-Stock

1+ parts

$21.500

100+ parts

-

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10k+ parts

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604

$21.500

-

-

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Semicontronic

India . 1,520 parts In-Stock

1+ parts

$36.500

100+ parts

$35.588

1k+ parts

$35.405

10k+ parts

-

1,520

$36.500

$35.588

$35.405

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Authorized Procurement Solutions

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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35,000

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Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

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6,720

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Corphita

USA . 4,667 parts In-Stock

1+ parts

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4,667

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GreenTree Electronics

Israel . 405 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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405

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Overview

Experience the unmatched reliability and performance of Texas Instruments with the TRSF3238ECDBR Line Drivers & Receivers. This versatile product is designed to meet the highest industry standards, providing seamless communication across various applications. With its advanced features and durable construction, this line driver/receiver ensures a stable and efficient operation. Trust in Texas Instruments for quality solutions that deliver exceptional value and benefits to customers looking for top-notch performance in their electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver and receiver, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for more flexibility in power source options, making this product suitable for a variety of applications.

No. of Functions: 3

Having multiple functions in one product simplifies circuit design and saves space on a PCB, making it a cost-effective choice for system integration.

Minimum Operating Temperature: 0 °C

The wide temperature range allows this product to operate in various environmental conditions, making it ideal for industrial or outdoor applications.

Maximum Output Low Current: 1.6 Amp

The high output current capability ensures that the line driver can deliver a strong signal to the receivers, resulting in reliable communication over long distances.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry standards ensures compatibility with a wide range of devices and systems, making integration seamless and hassle-free.

Technical Specifications

Line Drivers & Receivers TRSF3238ECDBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3238ECDBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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