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TRSF3238ECDB

Texas Instruments

TRSF3238ECDB by Texas Instruments

TRSF3238ECDB by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It has a small outline package style and nickel palladium gold terminal finish. Ideal for EIA-232-F, TIA-232-F, V.28 interface standards in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,189

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-

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Digiode

USA . 1,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,330

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,532 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,532

$5.500

-

-

-

Parana Technologies

USA . 109 parts In-Stock

1+ parts

$8.768

100+ parts

-

1k+ parts

$9.452

10k+ parts

-

109

$8.768

-

$9.452

-

IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$9.852

100+ parts

$9.359

1k+ parts

$8.867

10k+ parts

-

2,232

$9.852

$9.359

$8.867

-

ChromeModa Solutions

Germany . 733 parts In-Stock

1+ parts

$9.852

100+ parts

$8.079

1k+ parts

-

10k+ parts

-

733

$9.852

$8.079

-

-

AZTECH Wire

Italy . 714 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

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10k+ parts

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714

$12.086

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DigiPath Technology Company

USA . 1,769 parts In-Stock

1+ parts

-

100+ parts

$8.883

1k+ parts

-

10k+ parts

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1,769

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$8.883

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Corphita

USA . 821 parts In-Stock

1+ parts

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100+ parts

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821

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Microchip USA

USA . 426 parts In-Stock

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426

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Overview

Unleash the power of connectivity with the TRSF3238ECDB by Texas Instruments. As a leader in Line Drivers & Receivers, Texas Instruments delivers unmatched quality and reliability in every product. Whether you're looking to enhance communication in industrial automation, telecommunications, or consumer electronics, this small outline, shrink pitch package offers exceptional value and performance. With its dual terminal position, nickel palladium gold finish, and Schmitt trigger input characteristics, the TRSF3238ECDB provides seamless integration and superior functionality. Upgrade your systems today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in different operating conditions.

No. of Functions: 3

Multiple functions in one component reduce the need for additional chips, simplifying circuit design and saving space.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to integrate into PCB layouts, maximizing space efficiency.

Power Supplies (V): 3.3/5

Supports multiple power supply options, making it versatile for various applications.

No. of Terminals: 28

Sufficient number of terminals for connections, enabling complex signal routing in the circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style saves space on the PCB, ideal for designs with size constraints.

Maximum High Level Input Current: 0.000001 Amp

Low input current ensures minimal power consumption and reduced heat generation.

Minimum Supply Voltage: 3 V

Still operational at lower supply voltage, providing reliability in case of voltage fluctuations.

Maximum Operating Temperature: 70 °C

Wide temperature range tolerance ensures reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and ensures secure connections.

Maximum Seated Height: 2 mm

Low profile design saves space in the overall system and enables compact product designs.

Width: 5.3 mm

Narrow width facilitates tight packing of components on the PCB, optimizing space utilization.

Maximum Output Low Current: 1.6 Amp

High output current capability allows for driving larger loads without the need for additional components.

Receiver No. of Bits: 3

3-bit receiver allows for decoding and processing of multiple signals, enhancing data communication capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during reflow soldering process for efficient PCB assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder connections during assembly.

Length: 10.2 mm

Compact length minimizes space requirements on the PCB, suitable for designs with size constraints.

Minimum Out Swing: 10 V

Wide swing range allows for signal integrity and compatibility with a variety of input signals.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating temperature ranges, making it versatile for general applications.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time signal transmission, critical for time-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide secure solder connections and easy PCB mounting during assembly.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry standards ensures compatibility with a wide range of communication protocols and systems.

Maximum Supply Current: 2 mA

Low supply current consumption reduces power usage and heat dissipation, improving overall energy efficiency.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input ensures noise immunity and signal stability, enhancing overall reliability in data transmission.

Nominal Supply Voltage: 3.3 V

Optimal supply voltage for stable and efficient operation, ensuring reliable performance under normal operating conditions.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on the PCB, maximizing space utilization.

Driver No. of Bits: 5

5-bit driver enables encoding and transmitting multiple signals, enhancing data communication capabilities.

Interface IC Type: LINE TRANSCEIVER

Line transceiver type interface IC provides signal conditioning and conversion capabilities, ensuring smooth communication between devices.

Technical Specifications

Line Drivers & Receivers TRSF3238ECDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TRSF3238ECDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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