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TPS65983ACZQZR

Texas Instruments

TPS65983ACZQZR by Texas Instruments

TPS65983ACZQZR by Texas Instruments is a 96-terminal Power Management IC with 3.3V nominal voltage, suitable for power supply support circuits. It features a square package shape, very thin profile, and fine pitch grid array style, making it ideal for surface mount applications in various electronic devices. Operating temperature ranges from -10 to 85°C with a max seated height of 1mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,539 parts In-Stock

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Chip Stock

USA . 3,850 parts In-Stock

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3,850

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Digiode

USA . 804 parts In-Stock

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804

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Distributors (Availability)

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$3.500

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249

$3.500

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One Stop Electronics

USA . 1,119 parts In-Stock

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$6.500

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$6.500

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Semicontronic

India . 848 parts In-Stock

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$6.500

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$6.338

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$6.305

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848

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 700 parts In-Stock

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$9.321

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700

$9.321

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Parana Technologies

USA . 325 parts In-Stock

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$20.134

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$1,869.708

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$18.120

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325

$20.134

$1,869.708

$18.120

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DigiPath Technology Company

USA . 859 parts In-Stock

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$22.170

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$22.170

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ChromeModa Solutions

Germany . 3,015 parts In-Stock

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$22.622

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$18.550

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$22.622

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IDEA Electronic Components Group

UK . 1,581 parts In-Stock

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$22.622

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$21.491

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$20.360

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1,581

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Component Stockers USA

USA . 734 parts In-Stock

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$99.990

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Perfect Parts

USA . 11,200 parts In-Stock

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Lixinc

USA . 3,566 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

USA . 1,692 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corohmni

South Africa . 223 parts In-Stock

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Microchip USA

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Overview

Enhance the performance and efficiency of your electronic devices with the TPS65983ACZQZR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that are essential for various applications. With a focus on power supply support circuits, this product offers unmatched value by ensuring stable voltage supply and optimal energy management. Upgrade your devices today with the TPS65983ACZQZR and experience the benefits of Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the IC.

Surface Mount: YES

Makes it easy to integrate into circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with common power sources.

No. of Terminals: 96

Allows for a wide range of connections.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments.

Width (mm): 6 mm

Compact size for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions.

Minimum Supply Voltage (Vsup): 2.85 V

Works with lower voltage power sources.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes.

Technical Specifications

Power Management ICs TPS65983ACZQZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B96

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

2.85 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

TPS65983ACZQZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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