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TPS65921B1ZQZ

Texas Instruments

TPS65921B1ZQZ by Texas Instruments

TPS65921B1ZQZ by Texas Instruments is a Power Management IC with 120 terminals, operating voltage of 2.7-4.5V, and max output current of 1.2A. Ideal for industrial applications requiring precise power supply support in compact spaces due to its thin profile and fine pitch package design.

Median Price

$6.545

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 240 parts In-Stock

1+ parts

$9.050

100+ parts

$6.768

1k+ parts

$5.133

10k+ parts

-

240

$9.050

$6.768

$5.133

-

Rochester

USA . 322 parts In-Stock

1+ parts

-

100+ parts

$4.040

1k+ parts

$3.610

10k+ parts

$3.400

322

-

$4.040

$3.610

$3.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,457 parts In-Stock

1+ parts

$4.266

100+ parts

-

1k+ parts

-

10k+ parts

-

1,457

$4.266

-

-

-

Vyrian

USA . 8,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,915

-

-

-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

DigiKey Marketplace

USA . 322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

322

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,772 parts In-Stock

1+ parts

$4.041

100+ parts

-

1k+ parts

-

10k+ parts

-

1,772

$4.041

-

-

-

Parana Technologies

USA . 501 parts In-Stock

1+ parts

$22.050

100+ parts

-

1k+ parts

$22.615

10k+ parts

-

501

$22.050

-

$22.615

-

DigiPath Technology Company

USA . 1,625 parts In-Stock

1+ parts

$24.280

100+ parts

$22.337

1k+ parts

-

10k+ parts

-

1,625

$24.280

$22.337

-

-

ChromeModa Solutions

Germany . 2,870 parts In-Stock

1+ parts

$24.775

100+ parts

$20.316

1k+ parts

-

10k+ parts

-

2,870

$24.775

$20.316

-

-

IDEA Electronic Components Group

UK . 2,336 parts In-Stock

1+ parts

$24.775

100+ parts

$23.536

1k+ parts

$22.298

10k+ parts

-

2,336

$24.775

$23.536

$22.298

-

Microchip USA

USA . 273 parts In-Stock

1+ parts

$30.360

100+ parts

$30.170

1k+ parts

$30.070

10k+ parts

$29.980

273

$30.360

$30.170

$30.070

$29.980

Perfect Parts

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,120

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TPS65921B1ZQZ Power Management IC. As a leader in the industry, Texas Instruments delivers cutting-edge solutions for a wide range of applications. With a compact design and high performance capabilities, this product offers customers exceptional value, efficiency, and versatility. Trust Texas Instruments to provide you with the power management solution you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.6 V

Suitable voltage supply for powering the device efficiently and reliably.

No. of Terminals: 120

Having a high number of terminals allows for multiple connections and interfaces, enhancing the functionality of the product.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures the product can function in extreme cold conditions.

Maximum Output Current: 1.2 A

Capable of delivering a high output current, making it suitable for powering multiple components or devices simultaneously.

Technical Specifications

Power Management ICs TPS65921B1ZQZ attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B120

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

7

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,11X11,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+3.2V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

TPS65921B1ZQZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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