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TPS65920BZCH

Texas Instruments

TPS65920BZCH by Texas Instruments

TPS65920BZCH by Texas Instruments is a Power Management IC with 139 terminals, operating b/w -40 to 85°C. It supports 7 channels with a supply voltage range of 2.7V to 4.5V and nominal threshold voltages of +1.8V and +2.1V. Ideal for applications requiring precise power supply support in compact spaces due to its low profile grid array package design.

Median Price

$13.164

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 5 parts In-Stock

1+ parts

$13.164

100+ parts

$13.822

1k+ parts

$13.032

10k+ parts

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5

$13.164

$13.822

$13.032

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Vyrian

USA . 7,333 parts In-Stock

1+ parts

-

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Digiode

USA . 1,237 parts In-Stock

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1,237

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NexGen Digital

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 62 parts In-Stock

1+ parts

$2.995

100+ parts

-

1k+ parts

$3.500

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62

$2.995

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$3.500

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DigiPath Technology Company

USA . 1,855 parts In-Stock

1+ parts

$3.298

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1,855

$3.298

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IDEA Electronic Components Group

UK . 2,203 parts In-Stock

1+ parts

$3.365

100+ parts

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$3.028

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2,203

$3.365

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$3.028

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ChromeModa Solutions

Germany . 1,067 parts In-Stock

1+ parts

$3.365

100+ parts

$2.759

1k+ parts

-

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1,067

$3.365

$2.759

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One Stop Electronics

USA . 159 parts In-Stock

1+ parts

$5.500

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159

$5.500

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AZTECH Wire

Italy . 743 parts In-Stock

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$8.311

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743

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Corphita

USA . 4,156 parts In-Stock

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Microchip USA

USA . 401 parts In-Stock

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Kepictronics

USA . 225 parts In-Stock

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Overview

Power up your devices with the TPS65920BZCH by Texas Instruments, a top-quality Power Management IC designed to optimize performance and efficiency. With its advanced technology and reliable manufacturing from Texas Instruments, this product offers unparalleled value and benefits for a wide range of applications. From smartphones to laptops, this versatile IC is the perfect solution for all your power management needs, providing seamless operation and superior performance. Trust in Texas Instruments and elevate your devices to new heights with the TPS65920BZCH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto PCBs.

Nominal Supply Voltage (Vsup): 3.6 V

Suitable for a wide range of applications requiring a stable supply voltage.

No. of Terminals: 139

Provides flexibility in connections and compatibility with various systems.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact design while maintaining high performance and reliability.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation in various environments.

Minimum Operating Temperature: -40 °C

Operates effectively in cold conditions, making it suitable for diverse applications.

Terminal Position: BOTTOM

Allows for ease of connection and integration into electronic systems.

No. of Channels: 7

Provides multiple channels for power management, enhancing efficiency and versatility.

Terminal Form: BALL

Ball terminals facilitate soldering and ensure secure connections.

Technical Specifications

Power Management ICs TPS65920BZCH attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO AVAILABLE THRESHOLD ARE +2.65V, +2.85V, +2.7V, +3.2V

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B139

Length:

10 mm

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

139

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA139,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+1.8V,+2.1V

Width (mm):

10 mm

Trade Compliance

TPS65920BZCH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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