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TPS65913B2B8YFFR

Texas Instruments

TPS65913B2B8YFFR by Texas Instruments

TPS65913B2B8YFFR by Texas Instruments is a Power Management IC with 169 terminals, operating b/w -40 to 85°C. It offers power supplies of 3/5V and features a peak reflow temperature of 260°C. Ideal for industrial applications requiring efficient power supply management circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,185 parts In-Stock

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Digiode

USA . 1,742 parts In-Stock

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Prism Electronics

USA . 141 parts In-Stock

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141

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One Stop Electronics

USA . 1,097 parts In-Stock

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$4.500

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1,097

$4.500

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AZTECH Wire

Italy . 857 parts In-Stock

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$4.928

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857

$4.928

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Parana Technologies

USA . 1,679 parts In-Stock

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$5.403

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$501.768

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$4.863

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1,679

$5.403

$501.768

$4.863

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DigiPath Technology Company

USA . 1,985 parts In-Stock

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$5.950

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$5.474

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$5.950

$5.474

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

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$6.071

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$5.464

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1,587

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ChromeModa Solutions

Germany . 537 parts In-Stock

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$6.071

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$4.978

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537

$6.071

$4.978

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Kepictronics

USA . 6,019 parts In-Stock

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Corphita

USA . 1,479 parts In-Stock

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Overview

Elevate your power management capabilities with the TPS65913B2B8YFFR from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-of-the-line Power Management ICs that are essential for a wide range of applications. Whether you're in the automotive industry, telecommunications, or consumer electronics, this product offers unparalleled value with its efficient power supply management circuit. Trust Texas Instruments to provide you with the tools you need to optimize performance and enhance functionality in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, ideal for portable and budget-friendly applications.

Surface Mount: YES

With surface mount capability, the product can be easily integrated into compact PCB designs, saving space and enabling efficient layout configuration.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies, this product offers flexibility in power input options, catering to a wide range of devices and systems.

No. of Terminals: 169

Having a high number of terminals allows for enhanced connectivity and functionality, making the product suitable for complex power management requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments, improving overall product durability and longevity.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product can withstand cold conditions, making it suitable for a broad range of operational settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring stable and efficient power delivery.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Featuring a power supply management circuit, this product offers advanced control and monitoring capabilities, enhancing overall power efficiency and system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent component damage during the manufacturing process, ensuring product reliability and quality.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without degradation, ensuring consistent performance during assembly.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets high standards of reliability and performance in harsh operating conditions, making it a robust choice for industrial systems.

Technical Specifications

Power Management ICs TPS65913B2B8YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA169,13X13,16

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TPS65913B2B8YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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