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TPS659122YFFT

Texas Instruments

TPS659122YFFT by Texas Instruments

TPS659122YFFT by Texas Instruments is a Power Management IC with 81 terminals in a grid array package. It operates b/w -40 to 85°C, outputs up to 2.5A at 3.8V, and has a switching frequency of 2800 kHz. Ideal for industrial power supply management circuits due to its compact size and low supply current requirements.

Median Price

$7.791

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,121 parts In-Stock

1+ parts

$6.412

100+ parts

$5.228

1k+ parts

$3.485

10k+ parts

-

7,121

$6.412

$5.228

$3.485

-

Mouser Electronics

USA . 472 parts In-Stock

1+ parts

$9.170

100+ parts

$6.070

1k+ parts

$5.410

10k+ parts

-

472

$9.170

$6.070

$5.410

-

DigiKey

USA . 359 parts In-Stock

1+ parts

$9.170

100+ parts

$6.064

1k+ parts

$5.556

10k+ parts

$5.415

359

$9.170

$6.064

$5.556

$5.415

Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$5.020

1k+ parts

$4.490

10k+ parts

$4.220

20

-

$5.020

$4.490

$4.220

Verical

USA . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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16

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,113 parts In-Stock

1+ parts

$4.598

100+ parts

-

1k+ parts

-

10k+ parts

-

4,113

$4.598

-

-

-

Vyrian

USA . 8,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,899

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,425 parts In-Stock

1+ parts

$4.110

100+ parts

-

1k+ parts

-

10k+ parts

-

1,425

$4.110

-

-

-

Semicontronic

India . 1,245 parts In-Stock

1+ parts

$4.110

100+ parts

$4.007

1k+ parts

$3.987

10k+ parts

-

1,245

$4.110

$4.007

$3.987

-

Corphita

USA . 1,985 parts In-Stock

1+ parts

$4.356

100+ parts

-

1k+ parts

-

10k+ parts

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1,985

$4.356

-

-

-

Corohmni

South Africa . 165 parts In-Stock

1+ parts

$4.840

100+ parts

-

1k+ parts

-

10k+ parts

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165

$4.840

-

-

-

Parana Technologies

USA . 949 parts In-Stock

1+ parts

$13.734

100+ parts

-

1k+ parts

$14.224

10k+ parts

-

949

$13.734

-

$14.224

-

ChromeModa Solutions

Germany . 2,888 parts In-Stock

1+ parts

$15.432

100+ parts

$12.654

1k+ parts

-

10k+ parts

-

2,888

$15.432

$12.654

-

-

IDEA Electronic Components Group

UK . 1,991 parts In-Stock

1+ parts

$15.432

100+ parts

$14.660

1k+ parts

$13.889

10k+ parts

-

1,991

$15.432

$14.660

$13.889

-

GreenTree Electronics

Israel . 2,681 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,681

-

-

-

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DigiPath Technology Company

USA . 1,258 parts In-Stock

1+ parts

-

100+ parts

$13.913

1k+ parts

-

10k+ parts

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1,258

-

$13.913

-

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Kepictronics

USA . 370 parts In-Stock

1+ parts

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370

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Perfect Parts

USA . 159 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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159

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Overview

Enhance your power management solutions with the TPS659122YFFT by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and efficient power management ICs that cater to a wide range of applications. With a compact rectangular package style and a maximum output current of 2.5A, this IC provides superior performance in a variety of industrial settings. Trust Texas Instruments to provide you with the cutting-edge technology you need to optimize your power supply management circuits. Upgrade your systems today with the TPS659122YFFT and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

This makes the product easy to integrate into surface mount technology, saving space on the PCB and making assembly more efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for easier placement on the PCB and better utilization of space.

No. of Terminals: 81

With a high number of terminals, this product offers a wide range of connection options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Output Voltage: 0.5 V

The low minimum output voltage allows for precise regulation of power supply, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in cold environments without sacrificing performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these high-quality materials for terminal finish ensures reliable connections and long-term durability.

Maximum Output Voltage: 3.8 V

The high maximum output voltage allows for powering a variety of components and devices in a circuit.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to lay out the components on the PCB and provides a clean and organized appearance.

Width (mm): 3.598 mm

The compact width of the product saves space on the PCB and allows for more efficient circuit designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this product offers comprehensive control and monitoring of power supply, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage allows for versatile compatibility with different power sources and battery levels.

Length: 3.654 mm

The compact length of the product saves space on the PCB and allows for more efficient circuit designs.

Nominal Threshold Voltage (V): +2.5V

The nominal threshold voltage ensures stable and reliable operation within the specified voltage range.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in demanding industrial applications.

Maximum Switching Frequency: 2800 kHz

The high maximum switching frequency allows for fast and efficient power management, suitable for high-performance applications.

Maximum Supply Current (Isup): 0.055 mA

The low maximum supply current ensures efficient power usage and helps prolong the lifespan of the product.

Maximum Output Current: 2.5 A

The high maximum output current allows for powering a variety of components and devices with ease.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy soldering during assembly.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for compact and efficient layout on the PCB, saving space and reducing signal interference.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of power sources and applications.

No. of Outputs: 14

With a high number of outputs, this product offers versatile power distribution options for various components and devices in a circuit.

Technical Specifications

Power Management ICs TPS659122YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B81

JESD-609 Code:

e1

Length:

3.654 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

81

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Maximum Output Voltage:

3.8 V

Minimum Output Voltage:

.5 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.625 mm

Maximum Supply Current (Isup):

.055 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Maximum Switching Frequency:

2800 kHz

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2.5V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.598 mm

Trade Compliance

TPS659122YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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