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TPS6591104D1A2ZRCR

Texas Instruments

TPS6591104D1A2ZRCR by Texas Instruments

TPS6591104D1A2ZRCR by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85 °C. It has a max switching frequency of 3300 kHz and nominal voltage of 3.8 V. Ideal for power supply management circuits, this IC offers adjustable threshold voltage and 13 output channels in a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,600 parts In-Stock

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Digiode

USA . 2,770 parts In-Stock

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2,770

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,008 parts In-Stock

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$0.500

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$0.500

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Semicontronic

India . 256 parts In-Stock

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$2.500

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$2.438

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$2.425

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256

$2.500

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$2.425

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One Stop Electronics

USA . 1,239 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 379 parts In-Stock

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$12.210

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379

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Component Stockers USA

USA . 653 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,208 parts In-Stock

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Microchip USA

USA . 5,281 parts In-Stock

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Corphita

USA . 4,814 parts In-Stock

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Corohmni

South Africa . 462 parts In-Stock

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Overview

Experience unmatched power management efficiency with the TPS6591104D1A2ZRCR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs designed to optimize performance and minimize energy consumption. Ideal for a wide range of applications, this product offers customers the value, benefits, and advantages they need to enhance their systems. Trust in Texas Instruments for innovative solutions that elevate your power management capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8 V ensures stable and reliable power management.

No. of Terminals: 98

A high number of terminals allows for connectivity to multiple components and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can withstand harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper terminal finish enables good electrical conductivity and corrosion resistance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm helps in space-constrained applications.

Width (mm): 6 mm

The compact width of 6 mm enables the product to be used in small form factor devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit makes this product ideal for efficiently regulating and distributing power.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7 V ensures compatibility with a wide range of power sources.

Length: 9 mm

The length of 9 mm allows for flexible placement on the PCB.

Nominal Threshold Voltage (V): +2.1V

The nominal threshold voltage of +2.1V helps in accurate power management and control.

Maximum Switching Frequency: 3300 kHz

The high maximum switching frequency of 3300 kHz allows for fast and responsive power management operations.

No. of Channels: 13

Having 13 channels enables the product to manage and distribute power to multiple components efficiently.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and soldering.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand moderate exposure to moisture during handling and storage.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power input options.

No. of Outputs: 13

With 13 outputs, the product can distribute regulated power to multiple components effectively.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and fine-tuning of power management settings.

Technical Specifications

Power Management ICs TPS6591104D1A2ZRCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B98

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

13

No. of Functions:

1

No. of Outputs:

13

No. of Terminals:

98

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA98,8X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

3300 kHz

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2.1V

Width (mm):

6 mm

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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