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TPS6591103BA2ZRCR

Texas Instruments

TPS6591103BA2ZRCR by Texas Instruments

TPS6591103BA2ZRCR by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and offers 13 channels with a max switching frequency of 3300 kHz. Ideal for power supply management circuits in various applications due to its adjustable threshold feature and compact rectangular package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,246 parts In-Stock

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Digiode

USA . 728 parts In-Stock

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Semicontronic

India . 936 parts In-Stock

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$2.500

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$2.438

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$2.425

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936

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One Stop Electronics

USA . 225 parts In-Stock

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$3.500

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Ampacity Inc.

Singapore . 1,320 parts In-Stock

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AZTECH Wire

Italy . 498 parts In-Stock

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Corphita

USA . 1,840 parts In-Stock

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Microchip USA

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Corohmni

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Overview

Enhance the performance of your power management systems with the TPS6591103BA2ZRCR by Texas Instruments. Crafted with precision and reliability, this Power Management IC offers unparalleled quality and efficiency. Perfect for a wide range of applications, this product provides superior control and flexibility. Say goodbye to power management issues and hello to seamless operation with the TPS6591103BA2ZRCR. Elevate your projects with this exceptional component from a trusted manufacturer like Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, making it easy to handle and suitable for mass production.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, making the product suitable for high-volume manufacturing.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8V ensures compatibility with a wide range of applications and devices.

No. of Terminals: 98

The high number of terminals provides versatility and connectivity options for a variety of circuits and components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stability and reliability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function effectively in cold environments without sacrificing performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact and space-saving designs in electronic applications.

Width (mm): 6 mm

The width of 6mm makes the product suitable for compact and slim devices, saving space and enabling sleek designs.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with low-power devices and enables efficient power management.

Nominal Threshold Voltage (V): +2.1V

The nominal threshold voltage of +2.1V allows for precise voltage regulation and control in the power management circuit.

Maximum Switching Frequency: 3300 kHz

The high maximum switching frequency of 3300kHz enables fast and efficient operation, ideal for power supply management applications.

No. of Channels: 13

The high number of channels provides versatility and control options for multi-channel power management requirements.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture, making the product suitable for a variety of environments.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources and devices.

No. of Outputs: 13

The high number of outputs provides efficient power distribution and management capabilities for complex electronic systems.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization and fine-tuning of the power management circuit to meet specific requirements.

Technical Specifications

Power Management ICs TPS6591103BA2ZRCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B98

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

13

No. of Functions:

1

No. of Outputs:

13

No. of Terminals:

98

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA98,8X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

3300 kHz

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2.1V

Width (mm):

6 mm

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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