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TPS658623ZGUR

Texas Instruments

TPS658623ZGUR by Texas Instruments

TPS658623ZGUR by Texas Instruments is a Power Management IC with 14 channels, operating b/w -40 to 85°C. It has a low profile grid array package with 169 terminals and supports supply voltage from 2.3V to 5.5V. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,364 parts In-Stock

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Digiode

USA . 2,475 parts In-Stock

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Bristol Electronics

USA . 888 parts In-Stock

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ComSIT Distribution GmbH

Germany . 800 parts In-Stock

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800

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ComSIT USA

USA . 800 parts In-Stock

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800

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One Stop Electronics

USA . 187 parts In-Stock

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$4.500

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Parana Technologies

USA . 81 parts In-Stock

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$9.325

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$9.949

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DigiPath Technology Company

USA . 2 parts In-Stock

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$10.268

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$9.447

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ChromeModa Solutions

Germany . 4,019 parts In-Stock

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$10.478

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$8.592

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IDEA Electronic Components Group

UK . 227 parts In-Stock

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$10.478

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$9.954

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$9.430

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AZTECH Wire

Italy . 429 parts In-Stock

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$13.843

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Component Stockers USA

USA . 387 parts In-Stock

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$99.990

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Corphita

USA . 2,823 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Upgrade your power management solutions with the TPS658623ZGUR by Texas Instruments. Known for their top-notch quality and expertise in the field, Texas Instruments delivers exceptional products like this Power Management IC that is perfect for a wide range of applications. With a compact package shape, high reliability, and advanced features such as adjustable threshold and multiple channels, this IC offers unparalleled value and benefits to customers. Trust Texas Instruments to provide you with the best-in-class products for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the IC from external elements, making it a reliable choice for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

No. of Terminals: 169

Provides ample connectivity options, allowing for versatile integration into different electronic systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently even in high-temperature environments, ensuring consistent performance under varying conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it suitable for use in a wide range of applications.

Maximum Seated Height: 1.4 mm

Low profile design enables space-saving installation in compact electronic devices, enhancing overall design flexibility.

Minimum Supply Voltage (Vsup): 2.3 V

Supports a wide range of supply voltages, making it compatible with various power sources and systems.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for high voltage input, ensuring compatibility with a range of power supply configurations.

Adjustable Threshold: YES

Offers flexibility in setting voltage thresholds, allowing for customization and optimization of power management parameters.

Technical Specifications

Power Management ICs TPS658623ZGUR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

TPS658623ZGUR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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