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TPS658621AZGUT-1

Texas Instruments

TPS658621AZGUT-1 by Texas Instruments

TPS658621AZGUT-1 by Texas Instruments is a Power Management IC with GRID ARRAY package. It supports POWER SUPPLY circuits, has Tin Silver Copper finish, and can withstand 260°C peak reflow temperature. Ideal for applications requiring low profile and fine pitch components.

Median Price

$9.890

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 782 parts In-Stock

1+ parts

-

100+ parts

$8.560

1k+ parts

$7.660

10k+ parts

$7.210

782

-

$8.560

$7.660

$7.210

DigiKey

USA . 782 parts In-Stock

1+ parts

-

100+ parts

$9.890

1k+ parts

-

10k+ parts

-

782

-

$9.890

-

-

Verical

USA . 782 parts In-Stock

1+ parts

-

100+ parts

$10.700

1k+ parts

$9.575

10k+ parts

$9.012

782

-

$10.700

$9.575

$9.012

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,544 parts In-Stock

1+ parts

$9.034

100+ parts

-

1k+ parts

-

10k+ parts

-

3,544

$9.034

-

-

-

Vyrian

USA . 7,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,578

-

-

-

-

DigiKey Marketplace

USA . 782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

782

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,699 parts In-Stock

1+ parts

$5.671

100+ parts

-

1k+ parts

$6.465

10k+ parts

-

1,699

$5.671

-

$6.465

-

DigiPath Technology Company

USA . 811 parts In-Stock

1+ parts

$6.245

100+ parts

-

1k+ parts

-

10k+ parts

-

811

$6.245

-

-

-

ChromeModa Solutions

Germany . 1,438 parts In-Stock

1+ parts

$6.372

100+ parts

$5.225

1k+ parts

-

10k+ parts

-

1,438

$6.372

$5.225

-

-

IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$6.372

100+ parts

-

1k+ parts

$5.735

10k+ parts

-

960

$6.372

-

$5.735

-

Corphita

USA . 2,780 parts In-Stock

1+ parts

$8.559

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

$8.559

-

-

-

Component Stockers USA

USA . 964 parts In-Stock

1+ parts

$9.830

100+ parts

$9.230

1k+ parts

-

10k+ parts

-

964

$9.830

$9.230

-

-

Microchip USA

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

481

-

-

-

-

Kepictronics

USA . 229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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229

-

-

-

-

Overview

Enhance your power management solutions with the TPS658621AZGUT-1 from Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers innovative Power Management ICs designed to optimize performance and efficiency in various applications. This product boasts a package style that is both low profile and fine pitch, making it ideal for compact designs. With its tin silver copper terminal finish, this Power Supply Support Circuit provides customers with unmatched value and benefits, ensuring reliable power delivery for their electronic devices. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, optimizing layout design.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and fine pitch, making it suitable for applications requiring a compact design.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position allows for convenient installation and connection to the circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC type is specifically designed to support power supply functions, making it ideal for power management applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the IC can undergo reflow soldering quickly and efficiently during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and thermal stability during soldering process.

Terminal Form: BALL

Ball terminal form provides a reliable and secure connection to the circuit board, ensuring good electrical contact.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for safe handling and assembly in standard manufacturing environments.

Technical Specifications

Power Management ICs TPS658621AZGUT-1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TPS658621AZGUT-1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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