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TPS65561RGTR

Texas Instruments

TPS65561RGTR by Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$1.738

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,075 parts In-Stock

1+ parts

-

100+ parts

$1.640

1k+ parts

$1.470

10k+ parts

$1.380

20,075

-

$1.640

$1.470

$1.380

Verical

USA . 11,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.837

10k+ parts

$1.725

11,075

-

-

$1.837

$1.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 224 parts In-Stock

1+ parts

$1.235

100+ parts

-

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-

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-

224

$1.235

-

-

-

Vyrian

USA . 6,810 parts In-Stock

1+ parts

-

100+ parts

-

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-

6,810

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 15,461 parts In-Stock

1+ parts

$1.100

100+ parts

$1.072

1k+ parts

$1.067

10k+ parts

-

15,461

$1.100

$1.072

$1.067

-

Ampacity Inc.

Singapore . 15,318 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

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-

15,318

$1.100

-

-

-

Corphita

USA . 2,759 parts In-Stock

1+ parts

$1.170

100+ parts

-

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-

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-

2,759

$1.170

-

-

-

Corohmni

South Africa . 209 parts In-Stock

1+ parts

$1.300

100+ parts

-

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-

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209

$1.300

-

-

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AZTECH Wire

Italy . 996 parts In-Stock

1+ parts

$9.530

100+ parts

-

1k+ parts

-

10k+ parts

-

996

$9.530

-

-

-

Parana Technologies

USA . 49 parts In-Stock

1+ parts

$16.210

100+ parts

-

1k+ parts

$16.523

10k+ parts

-

49

$16.210

-

$16.523

-

DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$17.849

100+ parts

$16.421

1k+ parts

-

10k+ parts

-

1,429

$17.849

$16.421

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ChromeModa Solutions

Germany . 4,451 parts In-Stock

1+ parts

$18.213

100+ parts

$14.935

1k+ parts

-

10k+ parts

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4,451

$18.213

$14.935

-

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$18.213

100+ parts

$17.302

1k+ parts

$16.392

10k+ parts

-

2,329

$18.213

$17.302

$16.392

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Microchip USA

USA . 1,126 parts In-Stock

1+ parts

$38.510

100+ parts

$37.960

1k+ parts

$37.690

10k+ parts

$37.410

1,126

$38.510

$37.960

$37.690

$37.410

Perfect Parts

USA . 385 parts In-Stock

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-

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385

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Technical Specifications

Power Management ICs TPS65561RGTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

4 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3 V

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-35 Cel

Maximum Output Current:

2.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

4 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS65561RGTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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