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TPS650940A0RSKR

Texas Instruments

TPS650940A0RSKR by Texas Instruments

TPS650940A0RSKR by Texas Instruments is a Power Management IC with 12 channels, 21 A max output current, and 3100 kHz max switching frequency. Ideal for industrial applications requiring a supply voltage range of 5.6 V to 21 V and an operating temperature range from -40°C to 85°C.

Median Price

$6.884

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,855 parts In-Stock

1+ parts

$4.898

100+ parts

$3.993

1k+ parts

$2.662

10k+ parts

-

5,855

$4.898

$3.993

$2.662

-

Mouser Electronics

USA . 1,640 parts In-Stock

1+ parts

$8.870

100+ parts

$5.510

1k+ parts

$4.240

10k+ parts

$4.140

1,640

$8.870

$5.510

$4.240

$4.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$3.381

100+ parts

-

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700

$3.381

-

-

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Digiode

USA . 2,438 parts In-Stock

1+ parts

$4.653

100+ parts

-

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2,438

$4.653

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Vyrian

USA . 5,516 parts In-Stock

1+ parts

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5,516

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Martec Srl

Italy . 4,000 parts In-Stock

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4,000

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Cyclops Electronics Ltd

UK . 2,979 parts In-Stock

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2,979

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,887 parts In-Stock

1+ parts

$3.381

100+ parts

-

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3,887

$3.381

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Continental Prestige Electronics

USA . 2,016 parts In-Stock

1+ parts

$3.381

100+ parts

-

1k+ parts

-

10k+ parts

$3.313

2,016

$3.381

-

-

$3.313

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.381

100+ parts

-

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50

$3.381

-

-

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Corohmni

South Africa . 367 parts In-Stock

1+ parts

$4.100

100+ parts

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367

$4.100

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Semicontronic

India . 5,850 parts In-Stock

1+ parts

$4.160

100+ parts

$4.056

1k+ parts

$4.035

10k+ parts

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5,850

$4.160

$4.056

$4.035

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Ampacity Inc.

Singapore . 5,705 parts In-Stock

1+ parts

$4.160

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5,705

$4.160

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Corphita

USA . 243 parts In-Stock

1+ parts

$4.408

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243

$4.408

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$10.050

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669

$10.050

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Parana Technologies

USA . 63 parts In-Stock

1+ parts

$17.068

100+ parts

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$17.290

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63

$17.068

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$17.290

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DigiPath Technology Company

USA . 400 parts In-Stock

1+ parts

$18.794

100+ parts

$17.291

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400

$18.794

$17.291

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ChromeModa Solutions

Germany . 5,062 parts In-Stock

1+ parts

$19.178

100+ parts

$15.726

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5,062

$19.178

$15.726

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$19.178

100+ parts

$18.219

1k+ parts

$17.260

10k+ parts

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1,390

$19.178

$18.219

$17.260

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Kepictronics

USA . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,961 parts In-Stock

1+ parts

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8,961

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 4,000 parts In-Stock

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Lixinc

USA . 2,188 parts In-Stock

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2,188

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iodParts Technologies Inc.

India . 1,928 parts In-Stock

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1,928

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Overview

Enhance your power management solutions with the TPS650940A0RSKR by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers 12 channels of high-quality performance for a wide range of applications. With a maximum output current of 21A and a switching frequency of 3100 kHz, this chip carrier ensures optimal efficiency while maintaining a very thin profile. Whether you're looking to optimize power supply support circuits or enhance industrial-grade systems, the TPS650940A0RSKR delivers unparalleled reliability and performance. Upgrade your power management capabilities today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the Power Management IC, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 13 V

With a nominal supply voltage of 13V, this Power Management IC is designed to efficiently handle power requirements in various systems and devices.

Maximum Output Current: 21 A

The high maximum output current of 21A enables the Power Management IC to deliver sufficient power to multiple channels or devices, making it a reliable choice for demanding applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the Power Management IC can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Technical Specifications

Power Management ICs TPS650940A0RSKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Outputs:

12

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

21 A

Maximum Output Voltage:

3.575 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

21 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Maximum Switching Frequency:

3100 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

TPS650940A0RSKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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