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TPS65054RSMTG4

Texas Instruments

TPS65054RSMTG4 by Texas Instruments

TPS65054RSMTG4 by Texas Instruments is a Power Management IC with 32 terminals, operating at -40 to 85°C. It supports 6 channels with a max output current of 0.6A and a switching frequency of 2475kHz. Ideal for industrial applications requiring precise power supply support in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,805 parts In-Stock

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Digiode

USA . 874 parts In-Stock

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874

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Distributors (Availability)

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One Stop Electronics

USA . 1,596 parts In-Stock

1+ parts

$2.500

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1,596

$2.500

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Semicontronic

India . 952 parts In-Stock

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$5.500

100+ parts

$5.362

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$5.335

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952

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 1,217 parts In-Stock

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$6.500

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1,217

$6.500

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AZTECH Wire

Italy . 765 parts In-Stock

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$13.586

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765

$13.586

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Parana Technologies

USA . 339 parts In-Stock

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$13.715

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$14.207

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339

$13.715

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$14.207

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DigiPath Technology Company

USA . 884 parts In-Stock

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$15.102

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884

$15.102

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$15.410

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$14.640

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$13.869

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2,317

$15.410

$14.640

$13.869

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ChromeModa Solutions

Germany . 761 parts In-Stock

1+ parts

$15.410

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$12.636

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761

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$12.636

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Component Stockers USA

USA . 594 parts In-Stock

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$99.990

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Microchip USA

USA . 1,172 parts In-Stock

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Corphita

USA . 838 parts In-Stock

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Corohmni

South Africa . 361 parts In-Stock

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Overview

Discover the power of innovation with the TPS65054RSMTG4 by Texas Instruments. As a leader in the industry, Texas Instruments brings you top-quality Power Management ICs that are perfect for a wide range of applications. With its advanced features and reliability, this product offers unmatched value and benefits to customers looking for efficient and precise power supply support. Trust Texas Instruments to provide you with the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6 V is commonly used in many electronic devices, making this power management IC compatible with a wide range of applications.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, allowing for versatile integration within complex systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand elevated environmental conditions, making it suitable for industrial applications.

Minimum Output Voltage: 0.6 V

The minimum output voltage of 0.6 V ensures compatibility with low voltage components, enabling efficient power distribution within the system.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold finish on the terminals ensures reliable electrical connections and resistance to corrosion, enhancing the longevity of the product.

Maximum Output Voltage: 6 V

With a maximum output voltage of 6 V, this power management IC can deliver sufficient power to various components in the system, supporting stable operation.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this power management IC is built to withstand harsh operating conditions and ensure reliable performance in demanding environments.

Maximum Switching Frequency: 2475 kHz

The high maximum switching frequency allows for efficient power regulation and control, enabling rapid response to dynamic changes in power demand.

Technical Specifications

Power Management ICs TPS65054RSMTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2475 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

TPS65054RSMTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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