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TPS65051RSMTG4

Texas Instruments

TPS65051RSMTG4 by Texas Instruments

TPS65051RSMTG4 by Texas Instruments is a Power Management IC with 32 terminals, operating at -40 to 85 °C. It has a max output voltage of 6V and supports 6 channels, ideal for industrial applications requiring precise power supply support.

Median Price

$2.614

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.614

10k+ parts

$2.485

500

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-

$2.614

$2.485

Distributors (In-Stock)

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Chip Stock

USA . 17,260 parts In-Stock

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Vyrian

USA . 3,193 parts In-Stock

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Sensible Micro Corp

USA . 2,429 parts In-Stock

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Digiode

USA . 1,077 parts In-Stock

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1,077

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Distributors (Availability)

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Ampacity Inc.

Singapore . 77 parts In-Stock

1+ parts

$2.340

100+ parts

-

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77

$2.340

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Semicontronic

India . 22 parts In-Stock

1+ parts

$2.340

100+ parts

$2.282

1k+ parts

$2.270

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-

22

$2.340

$2.282

$2.270

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Corohmni

South Africa . 381 parts In-Stock

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$2.758

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381

$2.758

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AZTECH Wire

Italy . 865 parts In-Stock

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$12.600

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865

$12.600

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Parana Technologies

USA . 1,210 parts In-Stock

1+ parts

$16.927

100+ parts

$1,571.920

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$15.234

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1,210

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$1,571.920

$15.234

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DigiPath Technology Company

USA . 255 parts In-Stock

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$18.639

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255

$18.639

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$19.019

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$18.068

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$17.117

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2,015

$19.019

$18.068

$17.117

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ChromeModa Solutions

Germany . 222 parts In-Stock

1+ parts

$19.019

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$15.596

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222

$19.019

$15.596

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Component Stockers USA

USA . 2,513 parts In-Stock

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$57.940

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2,513

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Microchip USA

USA . 2,921 parts In-Stock

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Corphita

USA . 1,529 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the TPS65051RSMTG4 by Texas Instruments, a top-tier manufacturer in the Power Management ICs category. This innovative product offers unmatched reliability and efficiency, ensuring seamless power supply support for a wide range of applications. With its advanced features and high-quality components, this chip carrier with a very thin profile delivers exceptional value and benefits to customers looking for optimal performance and durability in their electronic designs. Choose Texas Instruments for superior quality and cutting-edge technology in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures compatibility with a wide range of electronic systems and components.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for various inputs and outputs, allowing for versatile usage.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliability in different conditions.

Minimum Output Voltage: 0.6 V

The minimum output voltage of 0.6V ensures precise power delivery, making it suitable for sensitive electronic components.

Maximum Output Voltage: 6 V

The maximum output voltage of 6V provides flexibility in powering various devices, making it a versatile choice for different applications.

Maximum Supply Current (Isup): 0.25 mA

With a maximum supply current of 0.25 mA, this product consumes minimal power, making it energy-efficient and cost-effective.

No. of Outputs: 6

Having 6 outputs allows for multiple devices to be powered simultaneously, making it a convenient solution for complex electronic systems.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and fine-tuning of voltage levels, ensuring precise power management for specific requirements.

Technical Specifications

Power Management ICs TPS65051RSMTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2475 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

TPS65051RSMTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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