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TPS65050RSMTG4

Texas Instruments

TPS65050RSMTG4 by Texas Instruments

TPS65050RSMTG4 by Texas Instruments is a Power Management IC with 32 terminals, operating voltage of 3.6V, and max output current of 0.6A. It is used in industrial applications requiring a compact chip carrier package with very thin profile for power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,500 parts In-Stock

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10,500

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Vyrian

USA . 7,849 parts In-Stock

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7,849

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Digiode

USA . 151 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,240 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,240

$1.500

$1.462

$1.455

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Parana Technologies

USA . 1,921 parts In-Stock

1+ parts

$3.263

100+ parts

-

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$3.788

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1,921

$3.263

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$3.788

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One Stop Electronics

USA . 142 parts In-Stock

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$3.500

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142

$3.500

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DigiPath Technology Company

USA . 590 parts In-Stock

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$3.593

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$3.305

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590

$3.593

$3.305

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ChromeModa Solutions

Germany . 627 parts In-Stock

1+ parts

$3.666

100+ parts

$3.006

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627

$3.666

$3.006

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$3.666

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$3.299

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5

$3.666

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$3.299

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AZTECH Wire

Italy . 401 parts In-Stock

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$6.454

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401

$6.454

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Ampacity Inc.

Singapore . 398 parts In-Stock

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$7.500

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398

$7.500

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Component Stockers USA

USA . 768 parts In-Stock

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$99.990

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768

$99.990

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Corphita

USA . 4,673 parts In-Stock

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Microchip USA

USA . 2,015 parts In-Stock

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Corohmni

South Africa . 318 parts In-Stock

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Overview

Enhance your power management solutions with the TPS65050RSMTG4 by Texas Instruments, a top-quality Power Management IC that offers unmatched reliability and performance. Manufactured using the latest technology, this product is perfect for a wide range of applications in various industries. With its innovative design and advanced features, customers can expect increased efficiency, reduced downtime, and overall cost savings. Trust Texas Instruments to provide you with the best-in-class products that deliver exceptional value and benefits to meet your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the Power Management IC.

Surface Mount: YES

The surface mount capability makes it easier to integrate this IC into electronic devices, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.6 V

With a reliable nominal supply voltage, this IC can efficiently manage power in devices that operate within this range.

No. of Terminals: 32

The 32 terminals provide flexibility for connecting various components and peripherals to the IC for comprehensive power management.

Maximum Output Voltage: 6 V

The high maximum output voltage allows for powering components that require higher voltage levels, making this IC versatile for different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can perform reliably in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold conditions, expanding its usability across various climates.

Maximum Output Current: 0.6 A

With a high maximum output current, this IC can efficiently deliver power to various components, supporting their performance without overloading.

No. of Channels: 6

Having six channels enables this IC to manage power distribution across multiple components or subsystems simultaneously, enhancing overall efficiency.

Technical Specifications

Power Management ICs TPS65050RSMTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2475 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

TPS65050RSMTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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