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TPS5511DR

Texas Instruments

TPS5511DR by Texas Instruments

TPS5511DR by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 125 °C. It supports a supply voltage range of 4-15 V and is ideal for automotive applications due to its small outline package and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,990 parts In-Stock

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6,990

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Digiode

USA . 2,405 parts In-Stock

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2,405

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Distributors (Availability)

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One Stop Electronics

USA . 1,577 parts In-Stock

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$0.500

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1,577

$0.500

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Semicontronic

India . 659 parts In-Stock

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$3.500

100+ parts

$3.412

1k+ parts

$3.395

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659

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 292 parts In-Stock

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$6.500

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292

$6.500

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AZTECH Wire

Italy . 200 parts In-Stock

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$9.456

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200

$9.456

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Parana Technologies

USA . 1,635 parts In-Stock

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$11.080

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$11.538

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1,635

$11.080

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$11.538

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DigiPath Technology Company

USA . 1,196 parts In-Stock

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$12.200

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$11.224

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1,196

$12.200

$11.224

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ChromeModa Solutions

Germany . 4,542 parts In-Stock

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$12.449

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$10.208

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$12.449

$10.208

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IDEA Electronic Components Group

UK . 1,603 parts In-Stock

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$12.449

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$11.827

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$11.204

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1,603

$12.449

$11.827

$11.204

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Corphita

USA . 2,730 parts In-Stock

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Corohmni

South Africa . 272 parts In-Stock

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Overview

Enhance your power management system with the TPS5511DR by Texas Instruments, a top-quality Power Management IC designed to meet the diverse needs of various applications. With its innovative design and reliable performance, this product offers customers unparalleled value and benefits. Trust in Texas Instruments' reputation for excellence and choose the TPS5511DR for your next project to experience enhanced efficiency and superior power management capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides for efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 5 V

Suitable for applications requiring a 5V supply voltage, which is a common standard in electronics.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality in the application.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme temperature conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact design and space-saving on the circuit board.

Width (mm): 3.905 mm

Narrow width enables the product to fit in tight spaces and applications with size constraints.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power supply support, ensuring efficient and reliable power management.

Minimum Supply Voltage (Vsup): 4 V

Wide supply voltage range allows for flexibility in various power input scenarios.

Length: 4.9 mm

Short length makes the product suitable for compact designs and space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature rating ensures reliability and performance in automotive applications.

No. of Channels: 3

Multiple channels provide versatility and capability for managing multiple power sources.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connection on the circuit board.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with commonly used connectors and sockets.

Maximum Supply Voltage (Vsup): 15 V

Ability to handle up to 15V supply voltage for applications requiring higher power input.

Technical Specifications

Power Management ICs TPS5511DR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.905 mm

Trade Compliance

TPS5511DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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