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TPS53832RWZR

Texas Instruments

TPS53832RWZR by Texas Instruments

TPS53832RWZR by Texas Instruments is a Power Management IC with 35 terminals, operating from -40 to 105°C. It supports 3 channels, with a supply voltage range of 4.5-15V. Ideal for power supply support circuits in various applications.

Median Price

$8.032

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,659 parts In-Stock

1+ parts

$6.624

100+ parts

$5.400

1k+ parts

$3.600

10k+ parts

-

5,659

$6.624

$5.400

$3.600

-

DigiKey

USA . 2,721 parts In-Stock

1+ parts

$9.440

100+ parts

$6.256

1k+ parts

$5.682

10k+ parts

$5.514

2,721

$9.440

$6.256

$5.682

$5.514

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 435 parts In-Stock

1+ parts

$6.293

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$6.293

-

-

-

Vyrian

USA . 2,353 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

2,353

$6.624

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 39 parts In-Stock

1+ parts

$5.440

100+ parts

-

1k+ parts

$6.150

10k+ parts

-

39

$5.440

-

$6.150

-

Semicontronic

India . 4,191 parts In-Stock

1+ parts

$5.630

100+ parts

$5.489

1k+ parts

$5.461

10k+ parts

-

4,191

$5.630

$5.489

$5.461

-

Corphita

USA . 3,665 parts In-Stock

1+ parts

$5.962

100+ parts

-

1k+ parts

-

10k+ parts

-

3,665

$5.962

-

-

-

DigiPath Technology Company

USA . 1,273 parts In-Stock

1+ parts

$5.990

100+ parts

$5.511

1k+ parts

-

10k+ parts

-

1,273

$5.990

$5.511

-

-

ChromeModa Solutions

Germany . 1,654 parts In-Stock

1+ parts

$6.112

100+ parts

$5.012

1k+ parts

-

10k+ parts

-

1,654

$6.112

$5.012

-

-

IDEA Electronic Components Group

UK . 1,023 parts In-Stock

1+ parts

$6.112

100+ parts

-

1k+ parts

$5.501

10k+ parts

-

1,023

$6.112

-

$5.501

-

Corohmni

South Africa . 395 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$6.624

-

-

-

Overview

Enhance the performance of your power management systems with the TPS53832RWZR by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers reliable solutions for a variety of applications in the Power Management ICs category. This innovative product offers customers unmatched value, benefits, and advantages, making it a top choice for those seeking efficient and effective power supply support circuits. Trust Texas Instruments to provide the superior technology you need for optimal performance in your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly costs.

Package Shape: SQUARE

The square shape of the package provides uniformity and stability during assembly, making it easier to handle and mount.

No. of Terminals: 35

With a higher number of terminals, this power management IC offers more connectivity options for complex circuit designs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions, making it versatile.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish enhances conductivity and durability, ensuring long-term performance and reliability.

Terminal Position: QUAD

The quad terminal position provides multiple contact points for stable and secure connections, enhancing the overall performance of the IC.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This type of IC is specifically designed to support power supply circuits, providing efficient and reliable power management capabilities.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage allows for operation in low-power applications, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during assembly, saving time and reducing production costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure solder joints and reliable connections during assembly.

No. of Channels: 3

With three channels, this power management IC can handle multiple power sources or loads simultaneously, providing flexibility in circuit design.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failures and improves overall reliability of the IC.

Terminal Pitch: 0.4 mm

The small terminal pitch enables high-density mounting on PCBs, allowing for compact and space-saving designs.

Moisture Sensitivity Level (MSL): 2

With a moderate moisture sensitivity level, this IC can withstand typical reflow processes without the risk of moisture-related damage.

Maximum Supply Voltage (Vsup): 15 V

The high maximum supply voltage makes this IC suitable for a wide range of power supply applications, increasing its versatility.

Technical Specifications

Power Management ICs TPS53832RWZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N35

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

35

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TPS53832RWZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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