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TPS3839G12DQNT

Texas Instruments

TPS3839G12DQNT by Texas Instruments

TPS3839G12DQNT by Texas Instruments is a Power Management IC with 1.2/6V power supplies, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates b/w -40 to 85°C. With a min supply voltage of 0.9V and max seated height of 0.4mm, it offers efficient power supply support in compact designs.

Median Price

$0.592

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 121,000 parts In-Stock

1+ parts

$0.724

100+ parts

$0.557

1k+ parts

$0.293

10k+ parts

-

121,000

$0.724

$0.557

$0.293

-

Rochester

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$0.516

1k+ parts

$0.428

10k+ parts

$0.382

8,000

-

$0.516

$0.428

$0.382

DigiKey

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.650

10k+ parts

-

8,000

-

-

$0.650

-

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.535

10k+ parts

$0.477

7,500

-

-

$0.535

$0.477

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.327

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.327

-

-

-

Digiode

USA . 320 parts In-Stock

1+ parts

$0.387

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$0.387

-

-

-

DigiKey Marketplace

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Vyrian

USA . 6,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,519

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.327

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$0.327

-

-

-

Ampacity Inc.

Singapore . 43,358 parts In-Stock

1+ parts

$0.346

100+ parts

-

1k+ parts

-

10k+ parts

-

43,358

$0.346

-

-

-

Corphita

USA . 2,552 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

-

10k+ parts

-

2,552

$0.366

-

-

-

Parana Technologies

USA . 2,376 parts In-Stock

1+ parts

$5.241

100+ parts

-

1k+ parts

$5.859

10k+ parts

-

2,376

$5.241

-

$5.859

-

DigiPath Technology Company

USA . 262 parts In-Stock

1+ parts

$5.771

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$5.771

-

-

-

ChromeModa Solutions

Germany . 4,889 parts In-Stock

1+ parts

$5.889

100+ parts

$4.829

1k+ parts

-

10k+ parts

-

4,889

$5.889

$4.829

-

-

IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$5.889

100+ parts

-

1k+ parts

$5.300

10k+ parts

-

1,113

$5.889

-

$5.300

-

Authorized Procurement Solutions

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,000

-

-

-

-

Overview

Unlock the power of efficient and reliable power management with the TPS3839G12DQNT by Texas Instruments. Trusted for its quality and innovation, Texas Instruments delivers cutting-edge technology in the Power Management ICs category. This small outline, heat sink package offers a wide operating temperature range and low supply current, making it ideal for industrial applications. Experience peace of mind knowing your power supply is in good hands with the TPS3839G12DQNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable.

Surface Mount: YES

This product can be easily mounted on a circuit board, saving space and making it ideal for compact designs.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, maximizing design flexibility.

Power Supplies (V): 1.2/6

With power supplies ranging from 1.2V to 6V, this product is versatile and compatible with a wide range of applications.

No. of Terminals: 4

The 4 terminals provide sufficient connections for power management, enhancing reliability and stability.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent heat dissipation and a compact profile, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures consistent performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold ensures excellent conductivity and corrosion resistance, prolonging the product's lifespan.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and allows for efficient power distribution.

Maximum Seated Height: 0.4 mm

With a maximum seated height of only 0.4mm, this product is suitable for thin and compact designs.

Width (mm): 1 mm

The narrow width of 1mm allows for easy integration into small electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This product, with power supply support circuitry, ensures stable power delivery and optimized performance.

Minimum Supply Voltage (Vsup): 0.9 V

The low minimum supply voltage requirement of 0.9V makes this product energy-efficient and suitable for low-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering of the product to the PCB.

Length: 1 mm

The compact length of 1mm enhances the product's suitability for space-constrained designs.

Nominal Threshold Voltage (V): +1.1V

The nominal threshold voltage of +1.1V ensures precise power management and regulation.

Temperature Grade: INDUSTRIAL

This product is designed for industrial-grade applications, ensuring reliable performance in harsh operating conditions.

Maximum Supply Current (Isup): 0.0005 mA

With a maximum supply current of only 0.0005mA, this product is energy-efficient and minimizes power consumption.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and enhances the product's reliability.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm allows for tight spacing of terminals on the PCB, optimizing layout efficiency.

Maximum Supply Voltage (Vsup): 6.5 V

The high maximum supply voltage of 6.5V ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs TPS3839G12DQNT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.1V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/6

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0005 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.1V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

TPS3839G12DQNT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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