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TPS3828-50QDBVRQ1

Texas Instruments

TPS3828-50QDBVRQ1 by Texas Instruments

TPS3828-50QDBVRQ1 by Texas Instruments is a Power Management IC with 5V nominal voltage, AEC-Q100 screening level, and -40 to 125°C operating temperature range. It is used in automotive applications for power supply management circuits due to its small outline package style and low profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 5,666 parts In-Stock

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Digiode

USA . 1,828 parts In-Stock

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Inventory MP

USA . 131 parts In-Stock

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Bristol Electronics

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Elcom Components

USA . 14 parts In-Stock

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LWI Electronics Inc

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Parana Technologies

USA . 2,074 parts In-Stock

1+ parts

$5.639

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$6.436

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$6.436

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DigiPath Technology Company

USA . 1,029 parts In-Stock

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$6.209

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$5.713

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ChromeModa Solutions

Germany . 2,419 parts In-Stock

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$6.336

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$5.196

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IDEA Electronic Components Group

UK . 50 parts In-Stock

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$6.336

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$5.702

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One Stop Electronics

USA . 884 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 434 parts In-Stock

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$12.543

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Component Stockers USA

USA . 447 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 3,188 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,718 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 1,487 parts In-Stock

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Overview

Experience the unrivaled quality and reliability of Texas Instruments with the TPS3828-50QDBVRQ1 Power Management IC. Designed for automotive applications, this innovative product offers a wide operating temperature range and low profile package style, making it ideal for demanding environments. With Texas Instruments' reputation for excellence in power supply management circuits, customers can trust in the superior performance and durability of the TPS3828-50QDBVRQ1. Upgrade your power management solutions today and experience the value that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable, this product offers easy installation and space-saving benefits in electronic circuits.

Nominal Supply Voltage (Vsup): 5 V

This product operates at a standard 5V supply voltage, making it compatible with a wide range of electronic devices and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can perform reliably in demanding industrial or automotive environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances the conductivity and durability of the terminals, ensuring long-term performance stability.

Width (mm): 1.6 mm

The compact width of 1.6mm allows for efficient space utilization on circuit boards, especially in applications where size constraints are critical.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent industry standards for temperature range, reliability, and performance in automotive environments.

Maximum Supply Current (Isup): 0.025 mA

With a low maximum supply current, this product helps minimize power consumption and is suitable for energy-efficient electronic designs.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm enables high-density mounting of components on a circuit board, facilitating compact and efficient design layouts.

Technical Specifications

Power Management ICs TPS3828-50QDBVRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3828-50QDBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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