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TPS3825-33DBVTG4

Texas Instruments

TPS3825-33DBVTG4 by Texas Instruments

TPS3825-33DBVTG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 1.1/5.5V power supplies range, and -40 to 85°C operating temperature. Ideal for industrial applications requiring low profile, small outline package with dual terminals and nickel/palladium/gold finish.

Median Price

$0.839

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.839

10k+ parts

$0.723

392

-

-

$0.839

$0.723

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.290

100+ parts

-

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150

$1.290

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Vyrian

USA . 7,059 parts In-Stock

1+ parts

-

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7,059

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-

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Digiode

USA . 794 parts In-Stock

1+ parts

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794

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Semi Source

USA . 58 parts In-Stock

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58

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Distributors (Availability)

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Ampacity Inc.

Singapore . 258 parts In-Stock

1+ parts

$0.710

100+ parts

-

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-

258

$0.710

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Semicontronic

India . 3 parts In-Stock

1+ parts

$0.710

100+ parts

$0.692

1k+ parts

$0.689

10k+ parts

-

3

$0.710

$0.692

$0.689

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

$1.214

10k+ parts

-

1,000

$1.264

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$1.214

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Continental Prestige Electronics

USA . 6,403 parts In-Stock

1+ parts

$1.290

100+ parts

-

1k+ parts

-

10k+ parts

$1.264

6,403

$1.290

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$1.264

Argo Parts USA

USA . 4,220 parts In-Stock

1+ parts

$1.290

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4,220

$1.290

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Corohmni

South Africa . 367 parts In-Stock

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$1.300

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367

$1.300

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AZTECH Wire

Italy . 582 parts In-Stock

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$14.798

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582

$14.798

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Parana Technologies

USA . 138 parts In-Stock

1+ parts

$22.127

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$22.738

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138

$22.127

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$22.738

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DigiPath Technology Company

USA . 1,427 parts In-Stock

1+ parts

$24.365

100+ parts

$22.416

1k+ parts

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1,427

$24.365

$22.416

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IDEA Electronic Components Group

UK . 1,800 parts In-Stock

1+ parts

$24.862

100+ parts

$23.619

1k+ parts

$22.376

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-

1,800

$24.862

$23.619

$22.376

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ChromeModa Solutions

Germany . 866 parts In-Stock

1+ parts

$24.862

100+ parts

$20.387

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866

$24.862

$20.387

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Microchip USA

USA . 2,915 parts In-Stock

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2,915

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Corphita

USA . 1,660 parts In-Stock

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1,660

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Overview

Discover the innovative TPS3825-33DBVTG4 by Texas Instruments, a top-quality Power Management IC that guarantees reliable performance. Designed by a trusted manufacturer, this product is ideal for a wide range of applications, offering customers unmatched value and benefits. With its small outline, low profile package shape and industrial temperature grade, this power supply support circuit provides peace of mind and efficiency. Upgrade your systems with the TPS3825-33DBVTG4 and experience superior power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal and electrical insulation, ensuring reliable performance.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications requiring stable power supply.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance, ensuring long-term reliability.

Nominal Threshold Voltage (V): +2.93V

Precise threshold voltage control for accurate power management.

Technical Specifications

Power Management ICs TPS3825-33DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3825-33DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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