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TPS3824-25QDBVRQ1

Texas Instruments

TPS3824-25QDBVRQ1 by Texas Instruments

TPS3824-25QDBVRQ1 by Texas Instruments is a Power Management IC with Vsup of 2.5V, Isup of 0.025mA, and operating temp range from -40 to 125 °C. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,825 parts In-Stock

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Digiode

USA . 3,295 parts In-Stock

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3,295

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Distributors (Availability)

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Ampacity Inc.

Singapore . 757 parts In-Stock

1+ parts

$2.500

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757

$2.500

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One Stop Electronics

USA . 1,349 parts In-Stock

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$7.500

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1,349

$7.500

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Semicontronic

India . 737 parts In-Stock

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$7.500

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$7.312

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$7.275

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737

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 777 parts In-Stock

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$9.380

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777

$9.380

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Parana Technologies

USA . 2,359 parts In-Stock

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$19.301

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$19.327

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2,359

$19.301

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$19.327

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DigiPath Technology Company

USA . 30 parts In-Stock

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$21.253

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$19.553

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30

$21.253

$19.553

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ChromeModa Solutions

Germany . 5,518 parts In-Stock

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$21.687

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$17.783

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

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$21.687

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$20.603

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$19.518

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2,210

$21.687

$20.603

$19.518

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Corphita

USA . 2,608 parts In-Stock

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Microchip USA

USA . 358 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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Overview

Enhance your automotive power management system with the TPS3824-25QDBVRQ1 by Texas Instruments. Designed with top-tier quality and reliability, this Power Management IC offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product ensures consistent and efficient power supply management. Trust in Texas Instruments' expertise to deliver cutting-edge solutions that provide seamless integration and superior functionality. Upgrade your systems today with the TPS3824-25QDBVRQ1 and experience the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and offers space-saving benefits in electronic circuit designs.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this product meets automotive industry standards for reliability and quality assurance.

Nominal Supply Voltage (Vsup): 2.5 V

The nominal supply voltage of 2.5V allows for compatibility with a wide range of electronic devices and applications.

Power Supplies (V): 1.1/5.5

Supporting power supplies ranging from 1.1V to 5.5V, this product is versatile and can be used in various power management scenarios.

No. of Terminals: 5

With 5 terminals, this product provides ample connection options and flexibility in design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold temperature environments without compromising performance.

Width (mm): 1.6 mm

The small width of 1.6mm enables compact and space-efficient PCB layout designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent temperature and reliability requirements for automotive electronics.

Technical Specifications

Power Management ICs TPS3824-25QDBVRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.25V; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3824-25QDBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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