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TPS3813K33DBVTG4

Texas Instruments

TPS3813K33DBVTG4 by Texas Instruments

TPS3813K33DBVTG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 6 terminals, and -40 to 85°C operating temperature range. It is used in industrial applications for power supply management circuits due to its small outline package and low profile design.

Median Price

$1.770

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$1.770

100+ parts

-

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30

$1.770

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Chip Stock

USA . 41,140 parts In-Stock

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41,140

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Digiode

USA . 4,482 parts In-Stock

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4,482

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Vyrian

USA . 3,382 parts In-Stock

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3,382

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North Shore Components

USA . 360 parts In-Stock

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360

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Bristol Electronics

USA . 172 parts In-Stock

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172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,556

$1.500

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Argo Parts USA

USA . 3,807 parts In-Stock

1+ parts

$1.770

100+ parts

-

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3,807

$1.770

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Continental Prestige Electronics

USA . 3,123 parts In-Stock

1+ parts

$1.770

100+ parts

-

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10k+ parts

$1.735

3,123

$1.770

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-

$1.735

Corohmni

South Africa . 273 parts In-Stock

1+ parts

$4.508

100+ parts

-

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273

$4.508

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Ampacity Inc.

Singapore . 1,284 parts In-Stock

1+ parts

$5.500

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1,284

$5.500

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Semicontronic

India . 342 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

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342

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$9.139

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246

$9.139

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$15.356

100+ parts

$14.588

1k+ parts

$14.588

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500

$15.356

$14.588

$14.588

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Parana Technologies

USA . 489 parts In-Stock

1+ parts

$17.436

100+ parts

$1,619.196

1k+ parts

$15.692

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489

$17.436

$1,619.196

$15.692

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DigiPath Technology Company

USA . 562 parts In-Stock

1+ parts

$19.199

100+ parts

$17.663

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562

$19.199

$17.663

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ChromeModa Solutions

Germany . 4,804 parts In-Stock

1+ parts

$19.591

100+ parts

$16.065

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4,804

$19.591

$16.065

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IDEA Electronic Components Group

UK . 1,707 parts In-Stock

1+ parts

$19.591

100+ parts

$18.611

1k+ parts

$17.632

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1,707

$19.591

$18.611

$17.632

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,640 parts In-Stock

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3,640

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Microchip USA

USA . 2,636 parts In-Stock

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2,636

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$1.735

1k+ parts

$1.681

10k+ parts

$1.646

500

-

$1.735

$1.681

$1.646

Perfect Parts

USA . 292 parts In-Stock

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292

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Overview

Discover the power of the TPS3813K33DBVTG4 by Texas Instruments, a high-quality Power Management IC that offers unmatched reliability and performance. Manufactured by a trusted industry leader, this product is designed to meet the demanding needs of various applications in the power management category. With its advanced features and design, customers can expect enhanced efficiency, stability, and durability for their projects. Experience the value and benefits of choosing Texas Instruments for your power management needs with the TPS3813K33DBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the Power Management IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3V is ideal for many applications, providing a stable power source for the Power Management IC to function optimally.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options, enabling the Power Management IC to be integrated into a variety of circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the Power Management IC can handle elevated temperatures without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the Power Management IC to function effectively in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections for the Power Management IC.

Width (mm): 1.6 mm

The compact width of 1.6mm enables the Power Management IC to be easily integrated into space-constrained designs, making it suitable for small form factor applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a Power Supply Management Circuit type IC, this product is specifically designed to efficiently regulate and control power distribution within electronic devices, ensuring optimal performance and power efficiency.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature grade indicates that the Power Management IC is designed to withstand harsh environmental conditions typical of industrial settings, making it a reliable choice for industrial applications.

Technical Specifications

Power Management ICs TPS3813K33DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.93V; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3813K33DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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