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TPS3809J25DBVTG4

Texas Instruments

TPS3809J25DBVTG4 by Texas Instruments

TPS3809J25DBVTG4 by Texas Instruments is a Power Management IC with a nominal voltage of 2.5V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates within a temperature range of -40 to 85°C. With surface mount capability and low profile design, it is ideal for power supply support circuits in various electronic devices.

Median Price

$0.581

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.581

10k+ parts

$0.496

13

-

-

$0.581

$0.496

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,148 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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7,148

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-

Chip Stock

USA . 4,350 parts In-Stock

1+ parts

-

100+ parts

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4,350

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Digiode

USA . 3,617 parts In-Stock

1+ parts

-

100+ parts

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3,617

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 13 parts In-Stock

1+ parts

$0.494

100+ parts

$0.482

1k+ parts

$0.479

10k+ parts

-

13

$0.494

$0.482

$0.479

-

Corohmni

South Africa . 76 parts In-Stock

1+ parts

$0.581

100+ parts

-

1k+ parts

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76

$0.581

-

-

-

Parana Technologies

USA . 1,295 parts In-Stock

1+ parts

$3.620

100+ parts

-

1k+ parts

$4.133

10k+ parts

-

1,295

$3.620

-

$4.133

-

DigiPath Technology Company

USA . 2,021 parts In-Stock

1+ parts

$3.986

100+ parts

$3.667

1k+ parts

-

10k+ parts

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2,021

$3.986

$3.667

-

-

IDEA Electronic Components Group

UK . 1,417 parts In-Stock

1+ parts

$4.067

100+ parts

-

1k+ parts

$3.660

10k+ parts

-

1,417

$4.067

-

$3.660

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ChromeModa Solutions

Germany . 1,117 parts In-Stock

1+ parts

$4.067

100+ parts

$3.335

1k+ parts

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1,117

$4.067

$3.335

-

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QUARKTWIN TECHNOLOGY LTD

USA . 9,841 parts In-Stock

1+ parts

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9,841

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Corphita

USA . 3,364 parts In-Stock

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3,364

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Perfect Parts

USA . 1,288 parts In-Stock

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1,288

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Microchip USA

USA . 938 parts In-Stock

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938

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Metaverse IC Inc.

Canada . 440 parts In-Stock

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440

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Overview

Experience next-level power management with the TPS3809J25DBVTG4 by Texas Instruments. Crafted with precision and care, this Power Management IC offers unparalleled reliability and performance. Perfect for a wide range of applications, this product ensures optimal efficiency and functionality. Trust in Texas Instruments to deliver top-notch quality and innovation that exceeds expectations. Say goodbye to power-related issues and hello to seamless operation with the TPS3809J25DBVTG4 - your ultimate solution for all power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 2.5 V

The nominal supply voltage of 2.5V ensures compatibility with a wide range of applications requiring low to moderate power levels.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function reliably in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring stable electrical connections over time.

Width (mm): 1.6 mm

The compact width of 1.6mm makes the product suitable for applications with space constraints, enabling versatile integration into various designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designates the product for use in rugged industrial environments, offering robust performance in demanding conditions.

Maximum Supply Current (Isup): 0.025 mA

With a low maximum supply current of 0.025 mA, the product helps to minimize power consumption and optimize energy efficiency in power management applications.

Technical Specifications

Power Management ICs TPS3809J25DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.25V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.25V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3809J25DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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