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TPS3613-01DGSG4

Texas Instruments

TPS3613-01DGSG4 by Texas Instruments

TPS3613-01DGSG4 by Texas Instruments is a Power Management IC with a nominal voltage of 1.8V and power supplies at 1.8/5V, suitable for industrial applications. It features a small outline package style, dual terminal position, and adjustable threshold voltage for precise power supply support circuitry. Operating temperature ranges from -40 to 85°C, making it ideal for various electronic devices requiring efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,499 parts In-Stock

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8,499

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Digiode

USA . 2,635 parts In-Stock

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2,635

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Nova Conductors

Japan . 40 parts In-Stock

1+ parts

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,889 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

2,889

$1.500

$1.462

$1.455

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Corohmni

South Africa . 976 parts In-Stock

1+ parts

$2.060

100+ parts

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976

$2.060

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One Stop Electronics

USA . 1,576 parts In-Stock

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$3.500

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1,576

$3.500

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Ampacity Inc.

Singapore . 1,092 parts In-Stock

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$5.500

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1,092

$5.500

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AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$8.856

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395

$8.856

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Parana Technologies

USA . 1,009 parts In-Stock

1+ parts

$9.311

100+ parts

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$9.936

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1,009

$9.311

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$9.936

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DigiPath Technology Company

USA . 42 parts In-Stock

1+ parts

$10.253

100+ parts

$9.433

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42

$10.253

$9.433

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

1+ parts

$10.462

100+ parts

$9.939

1k+ parts

$9.416

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1,579

$10.462

$9.939

$9.416

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ChromeModa Solutions

Germany . 85 parts In-Stock

1+ parts

$10.462

100+ parts

$8.579

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85

$10.462

$8.579

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Component Stockers USA

USA . 458 parts In-Stock

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$99.990

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458

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 18,550 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,747 parts In-Stock

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6,747

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Continental Prestige Electronics

USA . 6,276 parts In-Stock

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6,276

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Argo Parts USA

USA . 3,059 parts In-Stock

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3,059

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Corphita

USA . 2,226 parts In-Stock

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2,226

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Microchip USA

USA . 1,781 parts In-Stock

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1,781

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 277 parts In-Stock

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277

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Overview

Discover the innovative TPS3613-01DGSG4 by Texas Instruments, a top-tier Power Management IC that guarantees unmatched quality and reliability. Designed for industrial applications, this cutting-edge chip boasts a wide range of benefits including optimal power supply support, adjustable threshold voltage, and dual terminal position for easy installation. With its small outline, thin profile, and shrink pitch package style, this IC is a game-changer in the industry. Trust Texas Instruments to deliver exceptional performance and efficiency with the TPS3613-01DGSG4. Elevate your projects and experience seamless power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 1.8 V

Provides a stable and reliable power source for the IC, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

Can operate in high temperatures, making it suitable for industrial applications where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Technical Specifications

Power Management ICs TPS3613-01DGSG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.15V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3613-01DGSG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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