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TPS3110E12DBVR

Texas Instruments

TPS3110E12DBVR by Texas Instruments

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$1.658

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,744 parts In-Stock

1+ parts

$1.937

100+ parts

$1.697

1k+ parts

$0.959

10k+ parts

-

28,744

$1.937

$1.697

$0.959

-

Rochester

USA . 135 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

$1.230

10k+ parts

$1.160

135

-

$1.380

$1.230

$1.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 357 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

357

$1.264

-

-

-

Vyrian

USA . 8,220 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,220

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-

-

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NAC Semi

USA . 23 parts In-Stock

1+ parts

-

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-

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23

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,753 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

1,753

$1.197

-

-

-

Component Stockers USA

USA . 19,746 parts In-Stock

1+ parts

$1.360

100+ parts

$1.280

1k+ parts

$1.030

10k+ parts

$1.030

19,746

$1.360

$1.280

$1.030

$1.030

Parana Technologies

USA . 1,044 parts In-Stock

1+ parts

$10.457

100+ parts

-

1k+ parts

$10.970

10k+ parts

-

1,044

$10.457

-

$10.970

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ChromeModa Solutions

Germany . 3,399 parts In-Stock

1+ parts

$11.749

100+ parts

$9.634

1k+ parts

-

10k+ parts

-

3,399

$11.749

$9.634

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IDEA Electronic Components Group

UK . 1,256 parts In-Stock

1+ parts

$11.749

100+ parts

$11.162

1k+ parts

$10.574

10k+ parts

-

1,256

$11.749

$11.162

$10.574

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AZTECH Wire

Italy . 75 parts In-Stock

1+ parts

$18.240

100+ parts

-

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75

$18.240

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Perfect Parts

USA . 3,978 parts In-Stock

1+ parts

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3,978

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DigiPath Technology Company

USA . 141 parts In-Stock

1+ parts

-

100+ parts

$10.593

1k+ parts

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10k+ parts

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141

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$10.593

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Technical Specifications

Power Management ICs TPS3110E12DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.142V; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.4/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.027 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.142V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3110E12DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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