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TPS3103E12DBVTG4

Texas Instruments

TPS3103E12DBVTG4 by Texas Instruments

TPS3103E12DBVTG4 by Texas Instruments is a Power Management IC with Vsup of 1.2V, Isup of 0.022mA, and V range of 0.4-3.3V. It is used in industrial applications for power supply support circuits due to its small outline package and wide operating temperature range from -40 to 85°C.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 108 parts In-Stock

1+ parts

$0.630

100+ parts

$0.590

1k+ parts

-

10k+ parts

-

108

$0.630

$0.590

-

-

Chip1Stop

Japan . 108 parts In-Stock

1+ parts

$0.802

100+ parts

$0.590

1k+ parts

-

10k+ parts

-

108

$0.802

$0.590

-

-

Verical

USA . 108 parts In-Stock

1+ parts

-

100+ parts

$0.590

1k+ parts

-

10k+ parts

-

108

-

$0.590

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,772 parts In-Stock

1+ parts

$0.598

100+ parts

-

1k+ parts

-

10k+ parts

-

2,772

$0.598

-

-

-

Vyrian

USA . 6,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,715

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 108 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

108

$0.500

-

-

-

Corphita

USA . 2,690 parts In-Stock

1+ parts

$0.567

100+ parts

-

1k+ parts

-

10k+ parts

-

2,690

$0.567

-

-

-

Corohmni

South Africa . 333 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$0.590

-

-

-

Component Stockers USA

USA . 165 parts In-Stock

1+ parts

$0.610

100+ parts

$0.570

1k+ parts

-

10k+ parts

-

165

$0.610

$0.570

-

-

Semicontronic

India . 108 parts In-Stock

1+ parts

$1.090

100+ parts

$1.063

1k+ parts

$1.057

10k+ parts

-

108

$1.090

$1.063

$1.057

-

Parana Technologies

USA . 1,885 parts In-Stock

1+ parts

$11.418

100+ parts

-

1k+ parts

$11.840

10k+ parts

-

1,885

$11.418

-

$11.840

-

DigiPath Technology Company

USA . 2,048 parts In-Stock

1+ parts

$12.572

100+ parts

$11.567

1k+ parts

-

10k+ parts

-

2,048

$12.572

$11.567

-

-

ChromeModa Solutions

Germany . 5,243 parts In-Stock

1+ parts

$12.829

100+ parts

$10.520

1k+ parts

-

10k+ parts

-

5,243

$12.829

$10.520

-

-

IDEA Electronic Components Group

UK . 701 parts In-Stock

1+ parts

$12.829

100+ parts

$12.188

1k+ parts

$11.546

10k+ parts

-

701

$12.829

$12.188

$11.546

-

AZTECH Wire

Italy . 109 parts In-Stock

1+ parts

$13.220

100+ parts

-

1k+ parts

-

10k+ parts

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109

$13.220

-

-

-

Microchip USA

USA . 1,736 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,736

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Overview

Enhance your power management capabilities with the TPS3103E12DBVTG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions in the Power Management ICs category. This small outline, low profile IC offers a nominal supply voltage of 1.2V and a wide operating temperature range from -40°C to 85°C. Ideal for industrial applications, this power supply support circuit provides customers with efficient performance and peace of mind. Upgrade your power management system today with the TPS3103E12DBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it easier to handle and less prone to damage during handling and installation.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs in production.

Nominal Supply Voltage (Vsup): 1.2 V

The 1.2V nominal supply voltage is suitable for various low-power applications, ensuring efficient power management.

No. of Terminals: 6

Having 6 terminals provides versatility in connecting to other components and allows for flexibility in circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the IC can withstand harsh environmental conditions, making it reliable for industrial use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for power management applications.

Technical Specifications

Power Management ICs TPS3103E12DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.142V; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.4/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.022 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.142V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3103E12DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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