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TPS25940AQRVCTQ1

Texas Instruments

TPS25940AQRVCTQ1 by Texas Instruments

TPS25940AQRVCTQ1 by Texas Instruments is a Power Management IC with 20 terminals, operating voltage range of 2.7-18 V, and output current up to 5.3 A. It is designed for automotive applications, featuring a compact chip carrier package with very thin profile suitable for surface mount assembly. The IC offers adjustable threshold and operates in temperature range from -40 to 125 °C.

Median Price

$2.475

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$1.920

100+ parts

$1.285

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120

$1.920

$1.285

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Arrow

USA . 20 parts In-Stock

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$1.971

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20

$1.971

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Texas Instruments

USA . 10,985 parts In-Stock

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$2.475

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$1.904

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$1.002

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10,985

$2.475

$1.904

$1.002

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Mouser Electronics

USA . 778 parts In-Stock

1+ parts

$2.810

100+ parts

$1.710

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$1.330

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778

$2.810

$1.710

$1.330

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DigiKey

USA . 525 parts In-Stock

1+ parts

$2.810

100+ parts

$1.710

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$1.345

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$1.336

525

$2.810

$1.710

$1.345

$1.336

Verical

USA . 20 parts In-Stock

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20

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Distributors (In-Stock)

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Digiode

USA . 3,698 parts In-Stock

1+ parts

$1.824

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3,698

$1.824

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Nova Conductors

Japan . 700 parts In-Stock

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$2.000

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$2.000

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Chip Stock

USA . 13,750 parts In-Stock

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13,750

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Vyrian

USA . 7,965 parts In-Stock

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7,965

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Holdelec - ElecDif-Pro

France . 40 parts In-Stock

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40

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,454 parts In-Stock

1+ parts

$1.090

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-

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2,454

$1.090

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Semicontronic

India . 2,265 parts In-Stock

1+ parts

$1.090

100+ parts

$1.063

1k+ parts

$1.057

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2,265

$1.090

$1.063

$1.057

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Corohmni

South Africa . 184 parts In-Stock

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$1.572

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184

$1.572

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Corphita

USA . 2,512 parts In-Stock

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$1.728

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$1.728

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Continental Prestige Electronics

USA . 5,565 parts In-Stock

1+ parts

$2.000

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$1.960

5,565

$2.000

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$1.960

Argo Parts USA

USA . 1,011 parts In-Stock

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$2.000

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1,011

$2.000

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Netroflash

USA . 1,000 parts In-Stock

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$2.000

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1,000

$2.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$7.664

100+ parts

$6.974

1k+ parts

$6.284

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2,000

$7.664

$6.974

$6.284

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Parana Technologies

USA . 757 parts In-Stock

1+ parts

$8.620

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$9.288

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757

$8.620

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$9.288

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DigiPath Technology Company

USA . 1,890 parts In-Stock

1+ parts

$9.491

100+ parts

$8.732

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1,890

$9.491

$8.732

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ChromeModa Solutions

Germany . 4,348 parts In-Stock

1+ parts

$9.685

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$7.942

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4,348

$9.685

$7.942

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IDEA Electronic Components Group

UK . 895 parts In-Stock

1+ parts

$9.685

100+ parts

$9.201

1k+ parts

$8.716

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895

$9.685

$9.201

$8.716

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Futuretech Components

Singapore . 30,000 parts In-Stock

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Formix International (Excess)

India . 27,060 parts In-Stock

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Lixinc

USA . 15,487 parts In-Stock

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Infinite Electronics LLP (Excess)

. 10,202 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 5,000 parts In-Stock

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Kepictronics

USA . 260 parts In-Stock

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260

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TPS25940AQRVCTQ1 Power Management IC. Designed for automotive applications, this chip carrier offers precise power supply support with a nominal supply voltage of 3V and a maximum output current of 5.3A. With a wide operating temperature range and superior package material, this IC ensures optimal performance in any environment. Trust Texas Instruments for cutting-edge solutions that deliver efficiency and dependability in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making the product suitable for a variety of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration into electronic circuits, reducing assembly time and complexity.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage is a common standard in many electronic devices, making this power management IC compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this power management IC can reliably function in high-temperature environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this power management IC suitable for use in extreme cold conditions.

Maximum Output Current: 5.3 A

A high maximum output current of 5.3A allows this power management IC to efficiently power a variety of components and devices.

Technical Specifications

Power Management ICs TPS25940AQRVCTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.3 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS25940AQRVCTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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