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TPS2550DBVTG4

Texas Instruments

TPS2550DBVTG4 by Texas Instruments

TPS2550DBVTG4 by Texas Instruments is a power management IC with a nominal voltage of 3.3V and max supply voltage of 6.5V. It is used as a power supply support circuit in industrial applications, with its small outline and low profile package making it suitable for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 16,200 parts In-Stock

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Vyrian

USA . 5,474 parts In-Stock

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5,474

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Digiode

USA . 4,325 parts In-Stock

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4,325

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,247 parts In-Stock

1+ parts

$2.500

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1,247

$2.500

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Ampacity Inc.

Singapore . 827 parts In-Stock

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$4.500

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827

$4.500

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Semicontronic

India . 1,079 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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1,079

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 367 parts In-Stock

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$8.320

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367

$8.320

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Corohmni

South Africa . 41 parts In-Stock

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$14.955

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Parana Technologies

USA . 1,454 parts In-Stock

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$16.753

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$17.004

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1,454

$16.753

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$17.004

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DigiPath Technology Company

USA . 1,747 parts In-Stock

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$18.448

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$16.972

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1,747

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ChromeModa Solutions

Germany . 5,533 parts In-Stock

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$18.824

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$15.436

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$18.824

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

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$18.824

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$17.883

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$16.942

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2,293

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$16.942

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Continental Prestige Electronics

USA . 6,428 parts In-Stock

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Microchip USA

USA . 4,658 parts In-Stock

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Corphita

USA . 1,663 parts In-Stock

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Argo Parts USA

USA . 1,269 parts In-Stock

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1,269

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Experience power management like never before with the TPS2550DBVTG4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments brings you high-quality power management ICs that are designed to meet your unique needs. The TPS2550DBVTG4 offers numerous advantages, including its compact size, surface mount capabilities, and adjustable threshold. Whether you're looking to optimize battery life in portable devices or enhance power efficiency in industrial applications, this small but powerful IC is your perfect solution. Say goodbye to power management woes and unlock the true potential of your systems with the TPS2550DBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Matches common power requirements in many electronic devices, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in harsh environmental conditions with high temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for stable electrical connections.

Minimum Supply Voltage (Vsup): 2.5 V

Allows for operation in low-voltage applications, expanding the product's compatibility.

Peak Reflow Temperature °C: 260

Ensures proper soldering during assembly, enhancing product reliability and longevity.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions, ensuring consistent performance.

Maximum Supply Current (Isup): 0.15 mA

Offers low power consumption, making it energy-efficient and cost-effective for users.

Adjustable Threshold: YES

Allows for customization of voltage thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs TPS2550DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS2550DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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