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TPS2320IPWG4

Texas Instruments

TPS2320IPWG4 by Texas Instruments

TPS2320IPWG4 by Texas Instruments is a Power Management IC with 16 terminals, supporting supply voltages of 3.3/5V and 3/13V. It has a max output current of 500A, suitable for industrial applications requiring precise power supply support circuits in compact spaces.

Median Price

$1.960

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Digiode

USA . 3,254 parts In-Stock

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3,254

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Vyrian

USA . 3,053 parts In-Stock

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3,053

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Bristol Electronics

USA . 65 parts In-Stock

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$1.960

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65

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$1.960

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Microfarads

USA . 63 parts In-Stock

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63

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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Ampacity Inc.

Singapore . 1,261 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 995 parts In-Stock

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$4.121

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$4.573

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995

$4.121

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$4.573

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DigiPath Technology Company

USA . 939 parts In-Stock

1+ parts

$4.537

100+ parts

$4.174

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939

$4.537

$4.174

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ChromeModa Solutions

Germany . 6,090 parts In-Stock

1+ parts

$4.630

100+ parts

$3.797

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6,090

$4.630

$3.797

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IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$4.630

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$4.167

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One Stop Electronics

USA . 1,541 parts In-Stock

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$6.500

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1,541

$6.500

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AZTECH Wire

Italy . 379 parts In-Stock

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$8.851

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379

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Corphita

USA . 4,456 parts In-Stock

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Microchip USA

USA . 1,502 parts In-Stock

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Perfect Parts

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPS2320IPWG4 Power Management IC. This versatile component offers a wide range of applications in power supply support circuits, providing customers with exceptional value and performance. With a small outline package and dual terminal position, this IC is perfect for industrial use, offering a maximum output current of 500 A and adjustable threshold capabilities. Trust Texas Instruments for cutting-edge technology and innovative solutions in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for power management ICs that may be exposed to various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making the product suitable for compact designs.

Nominal Supply Voltage (Vsup): 4.5 V

4.5V supply voltage ensures stable and efficient power delivery to the connected devices, making it reliable in various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC can withstand heat and operate effectively in demanding industrial environments.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and fine-tuning of the power management settings to meet specific requirements, enhancing flexibility and usability.

Technical Specifications

Power Management ICs TPS2320IPWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS2320IPWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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