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TPS2111APWRG4

Texas Instruments

TPS2111APWRG4 by Texas Instruments

TPS2111APWRG4 by Texas Instruments is a Power Management IC with 2.8V nominal voltage, 1.5-5.5V supply range, and 0.09mA max current. It is used in power supply support circuits for industrial applications due to its small size, dual terminals, and adjustable threshold feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 21,960 parts In-Stock

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Vyrian

USA . 4,538 parts In-Stock

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Digiode

USA . 2,628 parts In-Stock

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Nova Conductors

Japan . 47 parts In-Stock

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One Stop Electronics

USA . 1,531 parts In-Stock

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$1.500

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1,531

$1.500

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Ampacity Inc.

Singapore . 504 parts In-Stock

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$5.500

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$5.500

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Semicontronic

India . 501 parts In-Stock

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$6.500

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$6.338

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$6.305

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501

$6.500

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$6.305

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Parana Technologies

USA . 1,696 parts In-Stock

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$7.301

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$7.795

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$7.795

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DigiPath Technology Company

USA . 471 parts In-Stock

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$8.039

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$8.039

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IDEA Electronic Components Group

UK . 1,246 parts In-Stock

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$8.203

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$7.383

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ChromeModa Solutions

Germany . 872 parts In-Stock

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$8.203

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$6.726

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AZTECH Wire

Italy . 703 parts In-Stock

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$10.721

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Corohmni

South Africa . 392 parts In-Stock

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Component Stockers USA

USA . 510 parts In-Stock

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Continental Prestige Electronics

USA . 6,456 parts In-Stock

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A-Z Elektronik GmbH

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Perfect Parts

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Corphita

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Argo Parts USA

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Microchip USA

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Bastille Electronics

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Overview

Enhance your power management capabilities with the TPS2111APWRG4 by Texas Instruments. Known for its superior quality and reliability, Texas Instruments offers a wide range of Power Management ICs for various applications. The TPS2111APWRG4 provides exceptional value with its dual channel design, adjustable threshold, and wide supply voltage range. With a compact package style and industrial temperature grade, this IC is perfect for demanding environments where precision and efficiency are crucial. Upgrade your power supply support circuit today with the TPS2111APWRG4 and experience the benefits of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic applications.

Nominal Supply Voltage (Vsup): 2.8 V

Efficient power management at a stable voltage level.

No. of Terminals: 8

Sufficient connections for various input and output requirements in power management.

Maximum Operating Temperature: 85 °C

Reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Enhanced conductivity and corrosion resistance for long-term usability.

Width (mm): 3 mm

Compact size for fitting in small electronic devices.

Minimum Supply Voltage (Vsup): 1.5 V

Flexible voltage input range for accommodating different power sources.

Peak Reflow Temperature °C: 260

Capability to withstand high-temperature soldering processes during assembly.

Temperature Grade: INDUSTRIAL

Designed to meet the reliability and durability standards for industrial applications.

Maximum Supply Current (Isup): 0.09 mA

Low power consumption for energy-efficient operation.

No. of Channels: 2

Ability to manage power distribution for multiple circuits efficiently.

Terminal Pitch: 0.65 mm

Fine pitch spacing for precise connections and reduced footprint on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Support for higher voltage inputs without risking component damage.

Adjustable Threshold: YES

Customizable threshold settings for adaptable power management solutions.

Technical Specifications

Power Management ICs TPS2111APWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

CAN SWITCH A VOLTAGE AS LOW AS 1.5V AS LONG AS THERE IS A MIN OF 2.8V AT ONE OF THE I/P POWER PINS

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.09 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2111APWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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