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TPS2071DAPR

Texas Instruments

TPS2071DAPR by Texas Instruments

TPS2071DAPR by Texas Instruments is a Power Management IC with 32 terminals, operating at -40 to 85 °C. It supports 5/6/9 V power supplies, ideal for industrial applications requiring a compact rectangular package with gull wing terminals and a max seated height of 1.2 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,626 parts In-Stock

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4,626

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Digiode

USA . 904 parts In-Stock

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904

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 510 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

510

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 693 parts In-Stock

1+ parts

$2.500

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-

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693

$2.500

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One Stop Electronics

USA . 584 parts In-Stock

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$5.500

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584

$5.500

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Parana Technologies

USA . 74 parts In-Stock

1+ parts

$5.864

100+ parts

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$6.647

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74

$5.864

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$6.647

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DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

$6.457

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525

$6.457

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ChromeModa Solutions

Germany . 6,593 parts In-Stock

1+ parts

$6.589

100+ parts

$5.403

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-

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6,593

$6.589

$5.403

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IDEA Electronic Components Group

UK . 1,957 parts In-Stock

1+ parts

$6.589

100+ parts

-

1k+ parts

$5.930

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1,957

$6.589

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$5.930

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AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$8.193

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629

$8.193

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QUARKTWIN TECHNOLOGY LTD

USA . 6,370 parts In-Stock

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6,370

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Microchip USA

USA . 5,749 parts In-Stock

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5,749

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Corphita

USA . 2,906 parts In-Stock

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Corohmni

South Africa . 160 parts In-Stock

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160

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Overview

Unlock the power of efficient and reliable power management with the TPS2071DAPR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Power Management ICs that are essential for a wide range of applications. With a focus on innovation and performance, this product offers customers unparalleled value and benefits. Whether you're looking to optimize power supplies or enhance system performance, the TPS2071DAPR is the ideal solution for your needs. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the IC lightweight and durable, allowing for easy handling and long-lasting performance.

Surface Mount: YES

Being surface mountable, this IC is easy to assemble onto circuit boards, making it suitable for automated manufacturing processes.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of electronic devices and systems, making it a versatile choice for various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this IC allows it to operate reliably in harsh environments with temperature fluctuations, ensuring consistent performance in demanding conditions.

No. of Channels: 4

With 4 channels, this IC can support multiple power supply circuits simultaneously, making it suitable for complex systems requiring multiple power sources.

Technical Specifications

Power Management ICs TPS2071DAPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G32

Length:

11 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,6/9

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6.1 mm

Trade Compliance

TPS2071DAPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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