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TPS2064DGNRG4

Texas Instruments

TPS2064DGNRG4 by Texas Instruments

TPS2064DGNRG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for power supply support circuits. It features a small outline package style, dual terminal position, and operates b/w 0-70°C temperature range. Ideal for applications requiring low supply current and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,574 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Digiode

USA . 2,461 parts In-Stock

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2,461

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Ampacity Inc.

Singapore . 1,618 parts In-Stock

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$1.500

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1,618

$1.500

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One Stop Electronics

USA . 1,594 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 474 parts In-Stock

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$7.292

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474

$7.292

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Parana Technologies

USA . 918 parts In-Stock

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$18.288

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$18.421

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918

$18.288

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$18.421

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DigiPath Technology Company

USA . 232 parts In-Stock

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$20.137

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$18.526

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232

$20.137

$18.526

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ChromeModa Solutions

Germany . 4,239 parts In-Stock

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$20.548

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$16.849

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$20.548

$16.849

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IDEA Electronic Components Group

UK . 870 parts In-Stock

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$20.548

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$19.521

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$18.493

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870

$20.548

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$18.493

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S.R.D Solutions

India . 30,000 parts In-Stock

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Lixinc

USA . 12,525 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,817 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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Microchip USA

USA . 2,096 parts In-Stock

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Corphita

USA . 1,284 parts In-Stock

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Kepictronics

USA . 989 parts In-Stock

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989

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Aranea Global

USA . 500 parts In-Stock

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Overview

Experience superior power management with the TPS2064DGNRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their power management ICs. This small outline, heat sink package offers a wide range of applications, providing customers with a versatile solution for their power supply support circuit needs. With a nominal supply voltage of 3.3V and dual terminal position, this IC ensures optimal performance in various commercial grade environments. Trust Texas Instruments to deliver exceptional products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for the package body, providing protection for the internal components.

Surface Mount: YES

Easily mountable on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

Ideal supply voltage for power management applications, ensuring compatibility with various devices.

Maximum Operating Temperature: 70 °C

Suitable for operation in a wide range of temperature environments, enhancing the product's versatility.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, making it suitable for diverse application scenarios.

No. of Channels: 2

Ability to handle multiple channels of power management, increasing efficiency and flexibility in managing power supply.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a higher supply voltage, enabling compatibility with a wider range of devices and systems.

Technical Specifications

Power Management ICs TPS2064DGNRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.0005 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2064DGNRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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