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TPS2063DRG4

Texas Instruments

TPS2063DRG4 by Texas Instruments

TPS2063DRG4 by Texas Instruments is a Power Management IC with 16 terminals, Vsup range of 2.7V to 5.5V, and Isup of 0.11mA. It is used in industrial applications for power supply support circuits due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,560 parts In-Stock

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4,560

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Vyrian

USA . 2,452 parts In-Stock

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2,452

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 569 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

569

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,135 parts In-Stock

1+ parts

$4.500

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1,135

$4.500

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AZTECH Wire

Italy . 277 parts In-Stock

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$7.643

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277

$7.643

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Parana Technologies

USA . 108 parts In-Stock

1+ parts

$20.766

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$20.912

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108

$20.766

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$20.912

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$22.866

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1,340

$22.866

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IDEA Electronic Components Group

UK . 2,089 parts In-Stock

1+ parts

$23.333

100+ parts

$22.166

1k+ parts

$21.000

10k+ parts

-

2,089

$23.333

$22.166

$21.000

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ChromeModa Solutions

Germany . 1,964 parts In-Stock

1+ parts

$23.333

100+ parts

$19.133

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1,964

$23.333

$19.133

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Microchip USA

USA . 3,912 parts In-Stock

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3,912

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Corphita

USA . 2,964 parts In-Stock

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2,964

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QUARKTWIN TECHNOLOGY LTD

USA . 2,944 parts In-Stock

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2,944

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Corohmni

South Africa . 316 parts In-Stock

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316

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Overview

Enhance your power management solutions with the TPS2063DRG4 by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This Power Management IC is designed to provide optimal performance in a compact package, making it perfect for a variety of applications. With features like a wide supply voltage range and industrial temperature grade, this product offers unmatched value and benefits to customers seeking efficient power supply support. Upgrade your systems today with the TPS2063DRG4 and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a variety of applications without adding unnecessary weight or cost.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic devices, making this power management IC compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can withstand harsh environmental conditions and operate reliably in challenging settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The gold finish on the terminals ensures good conductivity and corrosion resistance, contributing to the overall reliability and longevity of the product.

Width (mm): 3.9 mm

The compact width of 3.9mm allows for space-efficient PCB design and integration, making this product suitable for applications with limited board space.

Technical Specifications

Power Management ICs TPS2063DRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.11 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2063DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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