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TPS2061DRG4

Texas Instruments

TPS2061DRG4 by Texas Instruments

TPS2061DRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at -40 to 85°C. It supports supply voltages from 2.7V to 5.5V and has a max supply current of 0.0005mA. Ideal for industrial applications requiring power supply support circuits in compact form factors.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,134 parts In-Stock

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8,134

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Digiode

USA . 4,566 parts In-Stock

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4,566

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 248 parts In-Stock

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$1.500

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248

$1.500

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Parana Technologies

USA . 1,524 parts In-Stock

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$3.417

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$3.942

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1,524

$3.417

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$3.942

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DigiPath Technology Company

USA . 868 parts In-Stock

1+ parts

$3.762

100+ parts

$3.461

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868

$3.762

$3.461

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ChromeModa Solutions

Germany . 5,268 parts In-Stock

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$3.839

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$3.148

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5,268

$3.839

$3.148

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IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$3.839

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$3.455

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811

$3.839

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$3.455

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Ampacity Inc.

Singapore . 299 parts In-Stock

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$7.500

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299

$7.500

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Corohmni

South Africa . 464 parts In-Stock

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$8.291

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464

$8.291

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AZTECH Wire

Italy . 668 parts In-Stock

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$14.663

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668

$14.663

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Argo Parts USA

USA . 4,630 parts In-Stock

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Microchip USA

USA . 3,846 parts In-Stock

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Continental Prestige Electronics

USA . 2,566 parts In-Stock

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Kepictronics

USA . 2,550 parts In-Stock

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Corphita

USA . 2,038 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance your power management solutions with the TPS2061DRG4 by Texas Instruments. Known for their top-quality products, Texas Instruments has once again delivered a reliable and efficient Power Management IC that is perfect for a variety of applications. With its compact design and industrial-grade temperature grade, this small outline package offers superior performance and durability. Experience the benefits of precise power supply support and seamless integration with the TPS2061DRG4. Upgrade your power management system today and unlock new possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easier to handle and reducing manufacturing costs.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, saving space on the PCB and enabling higher component density.

Nominal Supply Voltage (Vsup): 3.3 V

This voltage is commonly used in many electronic devices, making this power management IC compatible with a wide range of applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures that the product can perform reliably in both extreme cold and hot environments.

Maximum Supply Current (Isup): 0.0005 mA

This low supply current helps in reducing power consumption and improving energy efficiency in the system.

Technical Specifications

Power Management ICs TPS2061DRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.0005 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2061DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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