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TPS2046BDG4

Texas Instruments

TPS2046BDG4 by Texas Instruments

TPS2046BDG4 by Texas Instruments is a Power Management IC with 3/5 V power supplies, 2 channels, and 8 terminals. It operates in industrial temperatures (-40 to 85°C) and supports supply voltages from 2.7V to 5.5V. Ideal for power supply support circuits in various applications due to its small outline package and surface-mount capability.

Median Price

$1.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 525 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.200

10k+ parts

$1.070

525

-

$1.440

$1.200

$1.070

DigiKey

USA . 525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.800

10k+ parts

-

525

-

-

$1.800

-

Verical

USA . 525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

525

-

-

$1.500

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,684 parts In-Stock

1+ parts

$0.834

100+ parts

-

1k+ parts

-

10k+ parts

-

3,684

$0.834

-

-

-

Vyrian

USA . 4,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,575

-

-

-

-

Bristol Electronics

USA . 1,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,784

-

-

-

-

Atlantic Semiconductor

USA . 1,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,784

-

-

-

-

DigiKey Marketplace

USA . 525 parts In-Stock

1+ parts

-

100+ parts

$0.910

1k+ parts

-

10k+ parts

-

525

-

$0.910

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,453 parts In-Stock

1+ parts

$0.790

100+ parts

-

1k+ parts

-

10k+ parts

-

4,453

$0.790

-

-

-

Component Stockers USA

USA . 864 parts In-Stock

1+ parts

$0.910

100+ parts

$0.850

1k+ parts

-

10k+ parts

-

864

$0.910

$0.850

-

-

Parana Technologies

USA . 436 parts In-Stock

1+ parts

$19.409

100+ parts

$1,802.431

1k+ parts

$17.468

10k+ parts

-

436

$19.409

$1,802.431

$17.468

-

DigiPath Technology Company

USA . 1,682 parts In-Stock

1+ parts

$21.372

100+ parts

$19.662

1k+ parts

-

10k+ parts

-

1,682

$21.372

$19.662

-

-

ChromeModa Solutions

Germany . 1,907 parts In-Stock

1+ parts

$21.808

100+ parts

$17.883

1k+ parts

-

10k+ parts

-

1,907

$21.808

$17.883

-

-

IDEA Electronic Components Group

UK . 691 parts In-Stock

1+ parts

$21.808

100+ parts

$20.718

1k+ parts

$19.627

10k+ parts

-

691

$21.808

$20.718

$19.627

-

Perfect Parts

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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420

-

-

-

-

Overview

Discover the power of Texas Instruments with the TPS2046BDG4 Power Management IC. Designed with quality and precision, this product offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this versatile device provides seamless power supply support circuitry for your projects. Experience the value and benefits of Texas Instruments as you enhance your systems with the TPS2046BDG4. Trust in Texas Instruments for superior performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in power management ICs for its durability and heat resistance, ensuring the IC can operate efficiently and reliably.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic devices, making this power management IC compatible with a wide range of applications.

Power Supplies (V): 3/5

This power management IC can support both 3V and 5V power supplies, offering flexibility in design and compatibility with various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can withstand harsh environmental conditions and maintain stable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making this IC suitable for a wide range of applications.

Width (mm): 3.9 mm

The compact width of this power management IC makes it suitable for space-constrained designs and allows for efficient PCB layout.

No. of Channels: 2

Having two channels enables this power management IC to handle multiple power sources or loads simultaneously, increasing its versatility and functionality.

Technical Specifications

Power Management ICs TPS2046BDG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.09 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2046BDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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