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TPS2041DG4

Texas Instruments

TPS2041DG4 by Texas Instruments

TPS2041DG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is ideal for industrial applications requiring compact design and high reliability in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,912 parts In-Stock

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7,912

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Digiode

USA . 808 parts In-Stock

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808

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 987 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

987

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,128 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,128

$5.500

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Ampacity Inc.

Singapore . 973 parts In-Stock

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$6.500

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973

$6.500

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Parana Technologies

USA . 2,113 parts In-Stock

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$11.912

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$12.311

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2,113

$11.912

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$12.311

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DigiPath Technology Company

USA . 252 parts In-Stock

1+ parts

$13.116

100+ parts

$12.067

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252

$13.116

$12.067

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IDEA Electronic Components Group

UK . 917 parts In-Stock

1+ parts

$13.384

100+ parts

$12.715

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$12.046

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917

$13.384

$12.715

$12.046

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ChromeModa Solutions

Germany . 491 parts In-Stock

1+ parts

$13.384

100+ parts

$10.975

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491

$13.384

$10.975

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AZTECH Wire

Italy . 588 parts In-Stock

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$17.583

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588

$17.583

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Corphita

USA . 4,358 parts In-Stock

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4,358

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Microchip USA

USA . 2,690 parts In-Stock

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Corohmni

South Africa . 339 parts In-Stock

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Overview

Enhance the performance and reliability of your power management systems with the TPS2041DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are essential for a wide range of applications. With its compact design and durable package body material, this product offers unmatched value and benefits to customers seeking efficient and reliable power solutions. Trust Texas Instruments to provide you with the cutting-edge technology you need to optimize your power management systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and thermal resistance, making the product reliable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape enables efficient placement on the PCB, optimizing space and layout design.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage level of 5V makes it compatible with many power systems and devices.

No. of Terminals: 8

Having 8 terminals allows for more connection options and flexibility in circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range makes it suitable for use in both hot and cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers excellent conductivity and corrosion resistance, enhancing the longevity and performance of the product.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved reliability in connections.

Width (mm): 3.899 mm

The compact width allows for space-saving integration in densely packed PCB layouts.

Minimum Supply Voltage (Vsup): 2.7 V

Operating at a low minimum voltage of 2.7V enables efficient power management in low-power applications.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring reliable soldering during assembly processes.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, where reliability and durability under harsh conditions are essential.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering, enhancing the product's assembly reliability.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum voltage rating of 5.5V, the product offers protection against voltage spikes and overloads.

Technical Specifications

Power Management ICs TPS2041DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.899 mm

Trade Compliance

TPS2041DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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