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TPS2041ADRG4

Texas Instruments

TPS2041ADRG4 by Texas Instruments

TPS2041ADRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and peak reflow temperature of 260°C. It is used in power supply support circuits for applications requiring a small outline package with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,137 parts In-Stock

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7,137

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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5,000

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Holdelec - ElecDif-Pro

France . 5,000 parts In-Stock

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5,000

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Bristol Electronics

USA . 3,753 parts In-Stock

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3,753

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Digiode

USA . 2,201 parts In-Stock

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2,201

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PC Components Company LLC

USA . 1,300 parts In-Stock

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AZTECH Wire

Italy . 721 parts In-Stock

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$5.438

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721

$5.438

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One Stop Electronics

USA . 1,200 parts In-Stock

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$7.500

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1,200

$7.500

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Parana Technologies

USA . 766 parts In-Stock

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$13.200

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$13.708

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766

$13.200

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$13.708

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DigiPath Technology Company

USA . 181 parts In-Stock

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$14.535

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$13.373

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181

$14.535

$13.373

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ChromeModa Solutions

Germany . 4,213 parts In-Stock

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$14.832

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$12.162

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4,213

$14.832

$12.162

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IDEA Electronic Components Group

UK . 629 parts In-Stock

1+ parts

$14.832

100+ parts

$14.090

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$13.349

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629

$14.832

$14.090

$13.349

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A-Z Elektronik GmbH

Germany . 16,643 parts In-Stock

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Kepictronics

USA . 7,320 parts In-Stock

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Corphita

USA . 3,124 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Microchip USA

USA . 1,040 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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Overview

Elevate your power management capabilities with the TPS2041ADRG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that set the industry standard. This small outline package offers a compact design with dual terminals, making it ideal for various applications. With a nominal supply voltage of 3.3V and a wide operating temperature range, this power supply support circuit provides unmatched performance and efficiency. Experience seamless integration and exceptional reliability with the TPS2041ADRG4 – the ultimate solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and portability.

Surface Mount: YES

Being surface mountable allows for easy installation and integration on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage is commonly used in many electronic devices, making this power management IC compatible with a wide range of applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting various components, enhancing the versatility and functionality of the power management IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this power management IC can function effectively in a wide range of temperature environments.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices with limited board real estate.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish ensures excellent conductivity, corrosion resistance, and reliability in electrical connections.

Terminal Position: DUAL

Having dual terminal positions provides design flexibility and ease of installation, accommodating different PCB layouts and configurations.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim and compact design, suitable for applications where space constraints are a concern.

Width (mm): 3.9 mm

The narrow width of 3.9mm enables easy integration into densely populated circuit boards, enhancing the overall design efficiency.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with a variety of low-power applications, making this power management IC versatile and adaptable.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient and reliable soldering during the manufacturing process, ensuring product quality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is within the standard reflow soldering temperature range, ensuring proper solder joint formation and product reliability.

Length: 4.9 mm

The compact length of 4.9mm contributes to the overall small form factor of the power management IC, making it suitable for space-constrained applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring secure and reliable electrical connections.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm facilitates high-density mounting on the PCB, allowing for more components to be packed closely together for enhanced functionality.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this power management IC can handle higher voltage requirements, making it suitable for a wide range of electronic applications.

Technical Specifications

Power Management ICs TPS2041ADRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2041ADRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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