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TPS2014DRG4

Texas Instruments

TPS2014DRG4 by Texas Instruments

TPS2014DRG4 by Texas Instruments is a Peripheral Driver with 8 terminals in a small outline package. It has a peak reflow temperature of 260°C and is suitable for commercial extended temperature grade applications. The interface IC type is buffer or inverter based, making it ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,608 parts In-Stock

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3,608

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Digiode

USA . 3,302 parts In-Stock

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3,302

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 722 parts In-Stock

1+ parts

$5.197

100+ parts

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722

$5.197

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Parana Technologies

USA . 1,665 parts In-Stock

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$8.196

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$8.806

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1,665

$8.196

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$8.806

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ChromeModa Solutions

Germany . 6,439 parts In-Stock

1+ parts

$9.209

100+ parts

$7.551

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6,439

$9.209

$7.551

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IDEA Electronic Components Group

UK . 354 parts In-Stock

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$9.209

100+ parts

$8.749

1k+ parts

$8.288

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354

$9.209

$8.749

$8.288

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One Stop Electronics

USA . 1,313 parts In-Stock

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$41.500

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1,313

$41.500

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Component Stockers USA

USA . 776 parts In-Stock

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$99.990

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776

$99.990

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Kepictronics

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,720 parts In-Stock

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Microchip USA

USA . 10,350 parts In-Stock

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Corphita

USA . 4,968 parts In-Stock

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4,968

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Metaverse IC Inc.

Canada . 2,216 parts In-Stock

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2,216

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DigiPath Technology Company

USA . 440 parts In-Stock

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$8.303

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440

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$8.303

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Overview

Enhance the performance of your electronic devices with the TPS2014DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality products that deliver exceptional results. The TPS2014DRG4 falls under the category of Peripheral Drivers, providing seamless integration and optimal functionality for your applications. With its small outline package style and dual terminal position, this product offers convenience and efficiency like no other. Trust Texas Instruments to bring you the best in technology, ensuring that your projects run smoothly and effectively every time. Upgrade your systems today with the TPS2014DRG4 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount design makes it easy to integrate into circuit boards.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and stacking in electronic devices.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space in electronic designs.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures good conductivity and corrosion resistance.

Maximum Seated Height: 1.75 mm

Low height allows for compact design and efficient use of space.

Width: 3.9 mm

Narrow width contributes to overall compactness of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for 30 seconds, ensuring stability during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability makes it suitable for various soldering processes.

Length: 4.9 mm

Compact length contributes to space-saving design.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance in a wide range of operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with various PCB designs.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based peripheral driver offers versatility in interfacing with different types of devices.

Technical Specifications

Peripheral Drivers TPS2014DRG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TPS2014DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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