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TPS2011ADRG4

Texas Instruments

TPS2011ADRG4 by Texas Instruments

TPS2011ADRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at -40 to 85°C. It supports supply voltages from 2.7V to 5.5V and has a max current of 0.1mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,695 parts In-Stock

1+ parts

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6,695

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Digiode

USA . 2,219 parts In-Stock

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2,219

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,133 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,133

$4.500

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Ampacity Inc.

Singapore . 605 parts In-Stock

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$4.500

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605

$4.500

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AZTECH Wire

Italy . 507 parts In-Stock

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$5.227

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507

$5.227

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Corohmni

South Africa . 25 parts In-Stock

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$7.501

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25

$7.501

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Parana Technologies

USA . 785 parts In-Stock

1+ parts

$8.356

100+ parts

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$8.986

10k+ parts

-

785

$8.356

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$8.986

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ChromeModa Solutions

Germany . 4,837 parts In-Stock

1+ parts

$9.389

100+ parts

$7.699

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4,837

$9.389

$7.699

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IDEA Electronic Components Group

UK . 926 parts In-Stock

1+ parts

$9.389

100+ parts

$8.920

1k+ parts

$8.450

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926

$9.389

$8.920

$8.450

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Continental Prestige Electronics

USA . 5,093 parts In-Stock

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5,093

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DigiPath Technology Company

USA . 2,221 parts In-Stock

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$8.465

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2,221

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$8.465

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Microchip USA

USA . 2,199 parts In-Stock

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2,199

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Corphita

USA . 2,090 parts In-Stock

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2,090

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 680 parts In-Stock

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680

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Overview

Experience the power of reliable performance with the TPS2011ADRG4 by Texas Instruments. Crafted with precision using high-quality materials, this Power Management IC offers unparalleled efficiency and durability for a wide range of applications. From industrial settings to consumer electronics, this versatile component ensures smooth operation and optimal power supply support. Trust Texas Instruments to deliver excellence in every product, providing you with the value and reliability you need to succeed. Upgrade your system today with the TPS2011ADRG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the package.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Ideal voltage level for powering various electronic components.

Maximum Operating Temperature: 85 °C

Ensures stable operation even in high temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperature conditions, making it versatile for different applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for reliable connections.

Width (mm): 3.9 mm

Compact size allows for space-saving designs in electronic systems.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, making it a specialized and efficient choice.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow processes during PCB assembly without compromising performance.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and performance are crucial.

Maximum Supply Current (Isup): 0.1 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Power Management ICs TPS2011ADRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2011ADRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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