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TPS2002CDRCR

Texas Instruments

TPS2002CDRCR by Texas Instruments

TPS2002CDRCR by Texas Instruments is a Power Management IC with 10 terminals, operating at -40 to 85°C. It has a nominal voltage of 5V and supports power supply circuits. This square-shaped IC is surface-mountable, with a small outline and very thin profile package style.

Median Price

$0.896

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,640 parts In-Stock

1+ parts

$0.896

100+ parts

$0.740

1k+ parts

$0.400

10k+ parts

-

8,640

$0.896

$0.740

$0.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,940 parts In-Stock

1+ parts

$0.851

100+ parts

-

1k+ parts

-

10k+ parts

-

2,940

$0.851

-

-

-

Vyrian

USA . 4,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,057

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,477 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

8,477

$0.760

-

-

-

Semicontronic

India . 8,404 parts In-Stock

1+ parts

$0.760

100+ parts

$0.741

1k+ parts

$0.737

10k+ parts

-

8,404

$0.760

$0.741

$0.737

-

Corphita

USA . 387 parts In-Stock

1+ parts

$0.806

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$0.806

-

-

-

Corohmni

South Africa . 85 parts In-Stock

1+ parts

$0.896

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$0.896

-

-

-

AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$19.340

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$19.340

-

-

-

Parana Technologies

USA . 166 parts In-Stock

1+ parts

$21.634

100+ parts

-

1k+ parts

$22.044

10k+ parts

-

166

$21.634

-

$22.044

-

DigiPath Technology Company

USA . 2,066 parts In-Stock

1+ parts

$23.822

100+ parts

$21.916

1k+ parts

-

10k+ parts

-

2,066

$23.822

$21.916

-

-

ChromeModa Solutions

Germany . 5,714 parts In-Stock

1+ parts

$24.308

100+ parts

$19.933

1k+ parts

-

10k+ parts

-

5,714

$24.308

$19.933

-

-

IDEA Electronic Components Group

UK . 1,510 parts In-Stock

1+ parts

$24.308

100+ parts

$23.093

1k+ parts

$21.877

10k+ parts

-

1,510

$24.308

$23.093

$21.877

-

Lixinc

USA . 18,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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18,942

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Overview

Elevate your power management experience with the TPS2002CDRCR by Texas Instruments. Crafted with precision and reliability in mind, this Power Management IC offers unparalleled performance for a wide range of applications. With its advanced technology and durable construction, this product ensures seamless operation and optimal efficiency. Trust in Texas Instruments to deliver top-tier quality and innovation, providing you with the value and benefits you deserve. Upgrade to the TPS2002CDRCR and elevate your power management solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, allowing for easier handling and lower overall production costs.

Surface Mount: YES

Surface mount capability provides efficient installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a 5V supply voltage allows for compatibility with a wide range of electronic devices, making this power management IC versatile.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enables compact design and efficient heat dissipation for better performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC can withstand demanding environmental conditions, ensuring reliability in various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials like nickel, palladium, and gold enhances conductivity and corrosion resistance, improving the overall longevity of the IC.

Width (mm): 3 mm

The compact width of 3mm allows for space-efficient PCB design, particularly important in tight or limited spaces where size matters.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a minimum supply voltage of 4.5V provides flexibility in power input options, ensuring compatibility with a wide range of power sources.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm contributes to a slim profile and compact form factor, ideal for applications with strict space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the IC's temperature grade ensures reliable performance under harsh operating conditions commonly found in industrial settings.

No. of Channels: 2

Having 2 channels allows for multiple power management functions to be controlled independently or in parallel, offering versatility and customization in system configurations.

Terminal Form: NO LEAD

The no-lead terminal form enhances solder joint reliability, reduces the risk of mechanical stress, and supports high-frequency operation for improved performance.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the IC is less prone to moisture-induced damage during storage and handling, maintaining its integrity and performance over time.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a safety margin for voltage fluctuations, ensuring stable and reliable operation in varying input voltage conditions.

Technical Specifications

Power Management ICs TPS2002CDRCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2002CDRCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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