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TPL7407LD

Texas Instruments

TPL7407LD by Texas Instruments

TPL7407LD by Texas Instruments is a 16-terminal interface IC with a max supply voltage of 40V and max output current of 0.5A. Ideal for automotive applications, it operates b/w -40 to 125°C, making it suitable for various electronic systems requiring precise control and monitoring in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,377 parts In-Stock

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8,377

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Digiode

USA . 1,628 parts In-Stock

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1,628

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Nova Conductors

Japan . 34 parts In-Stock

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,167 parts In-Stock

1+ parts

$2.052

100+ parts

-

1k+ parts

$2.574

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2,167

$2.052

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$2.574

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DigiPath Technology Company

USA . 530 parts In-Stock

1+ parts

$2.260

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530

$2.260

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ChromeModa Solutions

Germany . 848 parts In-Stock

1+ parts

$2.306

100+ parts

$1.891

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848

$2.306

$1.891

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IDEA Electronic Components Group

UK . 530 parts In-Stock

1+ parts

$2.306

100+ parts

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$2.075

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530

$2.306

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$2.075

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AZTECH Wire

Italy . 363 parts In-Stock

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$6.069

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363

$6.069

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Corohmni

South Africa . 228 parts In-Stock

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$7.399

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228

$7.399

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Ampacity Inc.

Singapore . 1,564 parts In-Stock

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$7.500

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1,564

$7.500

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One Stop Electronics

USA . 1,370 parts In-Stock

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$48.500

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1,370

$48.500

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Continental Prestige Electronics

USA . 5,607 parts In-Stock

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5,607

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Corphita

USA . 4,167 parts In-Stock

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4,167

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Argo Parts USA

USA . 1,327 parts In-Stock

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1,327

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the full potential of your electronic devices with the TPL7407LD by Texas Instruments. Designed with precision and expertise, this interface circuit IC offers unparalleled quality and reliability. From automotive applications to industrial control systems, this versatile product provides seamless integration and superior performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your electronics today with the TPL7407LD and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability in various applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and cost during production.

Maximum Supply Voltage: 40 V

Allows for compatibility with a wide range of power sources, making it versatile for different electronic setups.

Package Shape: RECTANGULAR

Facilitates compact and space-efficient design when integrating the IC into electronic systems.

Power Supplies (V): 1.5/5

Supports multiple power supply options, enhancing flexibility in system design.

No. of Terminals: 16

Offers ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

Allows for high-density mounting on PCBs, enabling efficient use of board space.

Minimum Supply Voltage: 8.5 V

Ensures compatibility with lower voltage sources, expanding the range of applications for the IC.

Maximum Operating Temperature: 125 °C

Suitable for use in automotive and industrial environments where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in harsh cold conditions, making the IC suitable for a wide range of environments.

Terminal Position: DUAL

Allows for flexible mounting and connection options, accommodating different PCB layouts and designs.

Maximum Seated Height: 1.75 mm

Low profile design enables the IC to be used in slim and compact electronic devices.

Width: 3.9 mm

Compact width dimensions make the IC suitable for applications where space is limited.

Length: 9.9 mm

Compact length dimensions contribute to space-saving integration in electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature resilience and reliability, making it suitable for automotive applications.

Maximum Output Current: 0.5 A

Capable of handling moderate output currents, suitable for driving various loads within electronic systems.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs, ensuring a secure and reliable connection.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for efficient connections and PCB layout, ensuring ease of assembly.

Driver No. of Bits: 7

Provides sufficient resolution for interfacing and controlling external devices or systems.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface applications, ensuring accurate and reliable communication between different parts of the system.

Technical Specifications

Other Function Interface ICs TPL7407LD attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Driver No. of Bits:

7

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

8.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TPL7407LD Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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