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TPD2E2U06QDCKRQ1

Texas Instruments

TPD2E2U06QDCKRQ1 by Texas Instruments

TPD2E2U06QDCKRQ1 by Texas Instruments is a single, surface mount transient suppression device with a max non-repetitive peak reverse power dissipation of 75W. It has a min breakdown voltage of 6.5V and is used for protecting electronic circuits from voltage spikes in applications such as automotive systems and industrial equipment.

Median Price

$0.361

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

1+ parts

$0.052

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-

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4

$0.052

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Texas Instruments

USA . 341,343 parts In-Stock

1+ parts

$0.287

100+ parts

$0.195

1k+ parts

$0.100

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-

341,343

$0.287

$0.195

$0.100

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Mouser Electronics

USA . 8,352 parts In-Stock

1+ parts

$0.750

100+ parts

$0.296

1k+ parts

$0.226

10k+ parts

-

8,352

$0.750

$0.296

$0.226

-

DigiKey

USA . 42,710 parts In-Stock

1+ parts

$0.810

100+ parts

$0.323

1k+ parts

$0.221

10k+ parts

-

42,710

$0.810

$0.323

$0.221

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Verical

USA . 1,544 parts In-Stock

1+ parts

-

100+ parts

$0.361

1k+ parts

$0.217

10k+ parts

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1,544

-

$0.361

$0.217

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Chip1Stop

Japan . 10 parts In-Stock

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10

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Distributors (In-Stock)

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Digiode

USA . 3,860 parts In-Stock

1+ parts

$0.164

100+ parts

-

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3,860

$0.164

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Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$0.244

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45

$0.244

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Sensible Micro Corp

USA . 118,285 parts In-Stock

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118,285

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Chip Stock

USA . 72,500 parts In-Stock

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72,500

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Vyrian

USA . 60,230 parts In-Stock

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60,230

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Cyclops Electronics Ltd

UK . 44,569 parts In-Stock

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44,569

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Distributors (Availability)

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Corohmni

South Africa . 280 parts In-Stock

1+ parts

$0.010

100+ parts

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280

$0.010

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Parana Technologies

USA . 1,554 parts In-Stock

1+ parts

$0.109

100+ parts

-

1k+ parts

$1.463

10k+ parts

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1,554

$0.109

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$1.463

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DigiPath Technology Company

USA . 417 parts In-Stock

1+ parts

$0.120

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417

$0.120

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ChromeModa Solutions

Germany . 3,059 parts In-Stock

1+ parts

$0.122

100+ parts

$0.100

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3,059

$0.122

$0.100

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IDEA Electronic Components Group

UK . 699 parts In-Stock

1+ parts

$0.122

100+ parts

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$0.110

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699

$0.122

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$0.110

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Semicontronic

India . 60,274 parts In-Stock

1+ parts

$0.147

100+ parts

$0.143

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$0.143

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60,274

$0.147

$0.143

$0.143

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Ampacity Inc.

Singapore . 60,265 parts In-Stock

1+ parts

$0.147

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60,265

$0.147

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Corphita

USA . 4,330 parts In-Stock

1+ parts

$0.156

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4,330

$0.156

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.161

100+ parts

$0.153

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$0.153

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200

$0.161

$0.153

$0.153

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Continental Prestige Electronics

USA . 3,172 parts In-Stock

1+ parts

$0.237

100+ parts

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$0.232

3,172

$0.237

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-

$0.232

Argo Parts USA

USA . 1,522 parts In-Stock

1+ parts

$0.237

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$0.230

1,522

$0.237

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-

$0.230

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.239

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$0.230

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2,000

$0.239

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$0.230

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Lixinc

USA . 16,426 parts In-Stock

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Kepictronics

USA . 16,048 parts In-Stock

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16,048

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A-Z Elektronik GmbH

Germany . 11,423 parts In-Stock

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11,423

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Infinite Electronics LLP (Excess)

. 10,668 parts In-Stock

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10,668

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Formix International (Excess)

India . 3,531 parts In-Stock

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3,531

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Overview

Experience superior quality and reliable performance with the TPD2E2U06QDCKRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures that this Transient Suppression Device exceeds your expectations. Whether you're protecting sensitive electronic components or safeguarding communication systems, this product offers unmatched value, benefits, and advantages. With its advanced technology and avalanche diode type, it guarantees optimal protection against voltage transients. Trust the TPD2E2U06QDCKRQ1 for maximum efficiency, durability, and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the device.

Maximum Non Repetitive Peak Reverse Power Dissipation: 75 W

This high power dissipation capability allows for reliable protection against transient voltage surges.

Minimum Breakdown Voltage: 6.5 V

The low breakdown voltage ensures that the device triggers at the appropriate voltage level to suppress transient voltage spikes effectively.

Technology: AVALANCHE

The avalanche technology used in this product enables quick response to transient events, providing efficient protection for sensitive electronic components.

Polarity: UNIDIRECTIONAL

The unidirectional design ensures that the device only conducts current in one direction, making it ideal for protecting sensitive components from transient voltage spikes.

Technical Specifications

Transient Suppression Devices TPD2E2U06QDCKRQ1 attributes and parameters. Explore more Transient Suppression Devices devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

8.5 V

Minimum Breakdown Voltage:

6.5 V

Maximum Clamping Voltage:

9.7 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

Maximum Non Repetitive Peak Reverse Power Dissipation:

75 W

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Maximum Reverse Current:

.01 uA

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TPD2E2U06QDCKRQ1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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