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TPD2E2U06QDBZRQ1

Texas Instruments

TPD2E2U06QDBZRQ1 by Texas Instruments

TPD2E2U06QDBZRQ1 by Texas Instruments is a single transient suppression device with a max clamping voltage of 9.7V, ideal for protecting sensitive electronics from voltage spikes. Its avalanche diode technology ensures reliable performance with a breakdown voltage range of 6.5-8.5V, meeting IEC standards for ESD protection in various applications. This small outline package with gull wing terminals operates b/w -40 to 125°C, making it suitable for diverse environments requiring robust overvoltage protection.

Median Price

$0.161

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,814,404 parts In-Stock

1+ parts

$0.144

100+ parts

$0.098

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$0.050

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1,814,404

$0.144

$0.098

$0.050

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Arrow

USA . 208 parts In-Stock

1+ parts

$0.276

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$0.173

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208

$0.276

$0.173

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Avnet

USA . 261,000 parts In-Stock

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-

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$0.217

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$0.200

261,000

-

-

$0.217

$0.200

Chip1Stop

Japan . 3,147 parts In-Stock

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-

100+ parts

$0.131

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$0.108

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$0.100

3,147

-

$0.131

$0.108

$0.100

Verical

USA . 3,097 parts In-Stock

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-

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$0.174

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$0.116

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$0.109

3,097

-

$0.174

$0.116

$0.109

DigiKey

USA . 1,194 parts In-Stock

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-

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$0.148

1,194

-

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$0.148

Distributors (In-Stock)

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Digiode

USA . 1,748 parts In-Stock

1+ parts

$0.137

100+ parts

-

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1,748

$0.137

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.243

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500

$0.243

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Bristol Electronics

USA . 16 parts In-Stock

1+ parts

$0.375

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16

$0.375

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Vyrian

USA . 298,667 parts In-Stock

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298,667

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Cyclops Electronics Ltd

UK . 43,414 parts In-Stock

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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ComSIT Distribution GmbH

Germany . 24,750 parts In-Stock

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North Shore Components

USA . 3,000 parts In-Stock

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Semi Source

USA . 39 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 299,428 parts In-Stock

1+ parts

$0.095

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299,428

$0.095

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Semicontronic

India . 299,393 parts In-Stock

1+ parts

$0.095

100+ parts

$0.093

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$0.092

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299,393

$0.095

$0.093

$0.092

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Corphita

USA . 4,990 parts In-Stock

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$0.130

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4,990

$0.130

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Parana Technologies

USA . 1,507 parts In-Stock

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$0.144

100+ parts

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$1.489

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1,507

$0.144

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$1.489

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DigiPath Technology Company

USA . 829 parts In-Stock

1+ parts

$0.159

100+ parts

$0.146

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829

$0.159

$0.146

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ChromeModa Solutions

Germany . 6,106 parts In-Stock

1+ parts

$0.162

100+ parts

$0.133

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6,106

$0.162

$0.133

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IDEA Electronic Components Group

UK . 1,693 parts In-Stock

1+ parts

$0.162

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$0.146

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1,693

$0.162

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Corohmni

South Africa . 384 parts In-Stock

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$0.163

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384

$0.163

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Netroflash

USA . 500 parts In-Stock

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$0.243

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$0.238

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500

$0.243

$0.238

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Continental Prestige Electronics

USA . 176 parts In-Stock

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$0.243

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$0.238

176

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Argo Parts USA

USA . 24 parts In-Stock

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$0.243

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$0.236

24

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Infinite Electronics LLP (Excess)

. 100,003 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,979 parts In-Stock

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Lixinc

USA . 8,448 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Overview

Enhance the reliability of your electronic devices with the TPD2E2U06QDBZRQ1 by Texas Instruments. Designed with top-quality materials and cutting-edge technology, this transient suppression device offers unparalleled protection against voltage spikes. Whether you're working on industrial machinery or consumer electronics, this product ensures smooth operation and peace of mind. Trust Texas Instruments to deliver superior performance and durability. Upgrade your designs today with the TPD2E2U06QDBZRQ1 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the device, making it suitable for various applications.

Maximum Non Repetitive Peak Reverse Power Dissipation: 75 W

The high power dissipation capability of 75W enables the device to handle sudden voltage surges effectively, providing reliable transient suppression.

Maximum Reverse Current: 0.01 uA

The low reverse current of 0.01uA indicates minimal leakage, enhancing the efficiency and performance of the device in suppressing transient voltage spikes.

Minimum Breakdown Voltage: 6.5 V

The minimum breakdown voltage of 6.5V ensures that the device can activate quickly and effectively in response to overvoltage conditions, providing protection to connected components.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with international standards such as IEC-61000-4-2, 4-4, 4-5 ensures that the device meets quality and safety requirements, making it a reliable choice for transient suppression.

Technical Specifications

Transient Suppression Devices TPD2E2U06QDBZRQ1 attributes and parameters. Explore more Transient Suppression Devices devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

8.5 V

Minimum Breakdown Voltage:

6.5 V

Maximum Clamping Voltage:

9.7 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

Maximum Non Repetitive Peak Reverse Power Dissipation:

75 W

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Maximum Reverse Current:

.01 uA

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TPD2E2U06QDBZRQ1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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